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caiman Design Analysis

Job 0f916018

1 Design Summary

77
out of 100
Depth of review, as a baseline: 306 verified datasheet parameters applied and 241 automated circuit checks performed. Additional checks that are not as easily quantifiable are also made.
Design TypeFlat (1 sheets)
Total Components125
Total Pins541
Total Nets94
Total Test Points0
Not Fitted (DNP)6
Improve your score:
Points deducted for open High/Medium AI findings:
AI findings to review:
AI assistance is enabled for this report. Each section marked "AI-Assisted" contains AI-generated engineering observations produced during schematic-phase design review. Findings are based solely on connectivity, component values, and net annotations present in the schematic data at the time of analysis. The AI has no access to PCB layout, routing, thermal data, BOM pricing or availability, assembly constraints, or any information outside the schematic. Findings are observations to investigate, not pass/fail judgments. The absence of a finding for a given device or net does not constitute a clearance. STANDARD MODE — this analysis was produced by the standard model tier.
Based on user-selected TP insertion settings, 10 test point(s) were added and a modified design is available for download. Review the modified schematic and resubmit to update this report.

1.1 Design Overview

AI-Assisted — The caiman design is a single-sheet board built around a high-performance Arm Cortex-M7 microcontroller. Around it sit three inertial and environmental sensors, a 2.4 GHz radio, a microSD card socket, addressable RGB indicators and a Hall-effect switch. Power comes in through high-current XT-series connectors, passes reverse-battery protection, and is converted by two fixed-output synchronous buck regulators that generate the +5V and +3V3 rails.

Processing Subsystem

U7 is an STMicroelectronics STM32F765VI in a 100-pin LQFP. Per the STMicroelectronics datasheet (Datasheet), it offers:

- a core clock of up to 216 MHz, delivering 462 DMIPS;
- 2048 KB of flash and 512 KB of SRAM, including 128 KB of data TCM;
- three 12-bit ADCs at up to 2.4 Msps and two 12-bit DACs;
- UARTs at up to 12.5 Mbit/s and SPI at up to 54 Mbit/s.

The core regulator runs from the internal LDO, with external stabilisation on VCAP_1 and VCAP_2. Two 3.2 × 2.5 mm four-pad crystals, Y1 and Y2, provide the board's clock references.

Sensing

A shared I2C bus from U7 carries three sensors:

- U5, an LPS22HB barometric pressure sensor at address 0x5C. It covers 260 hPa to 1260 hPa with 24-bit pressure output.
- U6, an LIS2MDL three-axis magnetometer at address 0x1E, with a ±49.152 gauss range.
- U8, an LSM6DSO six-axis IMU at address 0x6A. It offers accelerometer ranges up to ±16 g, gyroscope ranges up to ±2000 dps, and a 9 KB FIFO.

All three are STMicroelectronics parts (source: Tomachie). U3, a Melexis US1881 omnipolar-latching Hall-effect switch with an open-drain output, provides magnetic position or event sensing.

Wireless and Storage

U9 is a Nordic nRF24L01+ 2.4 GHz transceiver controlled by U7 over SPI. Per the Nordic Semiconductor datasheet (Datasheet), it supports:

- air data rates from 250 kbps to 2 Mbps;
- output power up to 0 dBm;
- receive sensitivity down to -94 dBm.

Its RF port is brought out as a 50 Ω single-ended path to the U.FL connector J14. J13, a Hirose microSD socket with card detect, is served by the MCU's SDMMC controller in 4-bit mode.

User Indicators

Three SK6812 addressable RGB LEDs (D2, D3, D4) provide status indication; each has 256-level PWM per colour and a single-wire 800 kHz interface. U10, a TI SN74LV1T34 single-gate level-translating buffer, is fitted on the board.

Power Architecture

The board has five rails: +BATT, VCC, +5V, +3V3 and GND.

- +5V is generated by U1, a Diodes Inc. AP63205 fixed 5 V buck regulator, through L1 (source: Tomachie).
- +3V3 is generated by U2, an AP63203 fixed 3.3 V buck regulator, through L2. Per the Diodes Inc. datasheet (Datasheet), both regulators accept 3.8 V to 32 V input and deliver 2 A continuous at 1.1 MHz with ±6 % frequency spread spectrum.

Power enters through J7 (XT30), J8 (XT60 male) and J9 (XT60 female). Input protection is provided by:

- U4, a TI LM74700 reverse-battery ideal-diode controller, rated 4 V to 60 V operating (source: Tomachie);
- D1, a 600 W SMBJ33CA bidirectional TVS;
- DZ1, an MMSZ5245 15 V zener.

The power path also carries a P-channel MOSFET (Q1) and Q2, an AOS AON6262E 60 V, 40 A N-channel MOSFET with a typical RDS(on) of 4.8 mΩ at VGS 10 V (Datasheet).

Interfaces and Mechanical

Off-board connectivity uses JST-GH connectors:

- J2 and J5 are six-way; J2 carries UART7 together with the sensor I2C bus.
- J3 is four-way and carries UART4.
- J10 and J12 are four-way and extend the sensor I2C bus.
- J11 is four-way and carries a second, independent I2C controller.

Two three-way 2.54 mm headers, J1 and J4, complete the I/O. Four plated M4 mounting holes (H1 to H4) are connected to a board net.

Temperature Rating

The AP63203/AP63205, the sensors, the nRF24L01+ and the SK6812 are rated −40 °C to +85 °C ambient. The LM74700 and SN74LV1T34 extend to +125 °C. The STM32F765VI's temperature-grade digit is not fixed in the schematic: grade 6 covers −40 °C to +85 °C and grade 7 covers −40 °C to +105 °C at maximum dissipation. The board's operating range is therefore −40 °C to +85 °C.

1.2 Processed Sheets

#Sheet Name
1caiman.kicad_sch

1.3 Structured DNP (Not Fitted)

Parts marked do-not-populate at the part level, outside of assembly variants. They remain present in the netlist but are not assembled.
StatusRefDesPart TypeValueFootprint
DNPJ6Conn_01x04_PinConn_01x04_PinConnector_PinHeader_2.54mm:PinHeader_1x06_P2.54mm_Vertical
DNPJ15Conn_01x03_PinConn_01x03_PinConnector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical
DNPR252.2k2.2kResistor_SMD:R_0402_1005Metric
DNPR282.2k2.2kResistor_SMD:R_0402_1005Metric
DNPR292.2k2.2kResistor_SMD:R_0402_1005Metric
DNPR312.2k2.2kResistor_SMD:R_0402_1005Metric

1.4 Footprint Compliance

Production pick-n-place, AOI, AXI, ATE and Design Quality tools rely on proper descriptions of component footprints.

Footprint NamingStatus
22 SMT footprints do not follow IPC-7351B naming
8 footprints (connectors, specialty) — compliance unknown

2 Component Value Properties

Component values should be in the VALUE property, either as a direct value (e.g. 100nF) or as a formula reference (e.g. =Capacitance). The typed property (Resistance, Capacitance, Inductance, Impedance, etc.) holds the actual electrical value; VALUE should point to it or contain the same data.

The part-number cross-check could not be performed: no part-number property is populated on the passive components. The AI-enriched run resolves part identities and enables this check.
Value Property Check
TypeCheckCountComponentsStatus
CapacitorsValues in VALUE or Capacitance51C45, C50, C16, C29, C25, C20, C15, C39 (+43 more)✓
ResistorsValues in VALUE or Resistance27R8, R23, R4, R2, R18, R26, R10, R24 (+19 more)✓
InductorsValues in VALUE or Inductance5L5, L3, L1, L2, L4✓
CrystalsValues in VALUE or Frequency2Y1, Y2✓

2.1 Part Number vs Stated Values

Each passive states its electrical facts twice: in the properties the designer set, and encoded inside the MANUFACTURER part number. This check decodes the manufacturer part number and compares the two. A distributor catalogue number is a different thing and cannot be used here - an LCSC C-number or a Digi-Key -ND number identifies a stock item, it encodes no capacitance, voltage or tolerance, so there is nothing in it to check against. Where the two readings disagree both are shown and neither is assumed correct: if VALUE is wrong the analysis used the wrong number, and if the part number is wrong the BOM orders the wrong part. Only the designer knows which field is authoritative. Parts whose numbering scheme is not recognized are reported as not checked rather than passed.

83 of 83 fitted resistor/inductor/capacitor part(s) carry no ordering part number: C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C16, C17, C18, C19, C20 (+63 more). Without a part number the BOM cannot state what to buy, and none of the part-number cross-checks in this section can run for these parts. Add a manufacturer part number to each part in the library.

2.2 Capacitor Derating Check

Derating profileBenign (controlled office)
Maximum ambient40 °C
Checks performed0
A capacitor is checked here when the comparison can be made without an operating-point calculation: it has two terminals, sits between a power rail and ground so the rail's resolved voltage is the voltage across it, and states a voltage rating - a Voltage property, or a rating decoded from the part number. Every other derating check - for capacitors and for every other part class - is applied by the AI analysis within its report sections.
25 part(s) sit across a resolved power rail with no stated voltage rating and could not be checked: C11, C22, C23, C25, C26, C27, C3, C30, C31, C32, C33, C34, .... Record each rating in a Voltage property.
Derating Settings Used in This Analysis
ParameterValueSourceApplied
capacitor_voltage_pct30% (70)Quanterion 2nd ed. Table 2.3-1 p37 / Table 3.1-4 p49 - ceramic film mica glassApplied by the AI analysis where the rating is in evidence
capacitor_aluminum_voltage_pct20% (80)Quanterion 2nd ed. Table 2.3-1 p37Applied by the AI analysis where the rating is in evidence
capacitor_tantalum_mno2_voltage_pct50% (50)Quanterion 2nd ed. Table 2.3-1 p37 standard-process MnO2Applied by the AI analysis where the rating is in evidence
capacitor_tantalum_polymer_voltage_pct20% (80)Quanterion 2nd ed. Table 2.3-1 p37 polymer / enhanced MnO2 / niobiumApplied by the AI analysis where the rating is in evidence
capacitor_ripple_current_pctNot derated by this scheme - the manufacturer's rating is the limitnot stated by this schemeNot applied - the AI is not given this parameter
capacitor_temperature_margin_c10 °CQuanterion 2nd ed. Table 2.3-1 p37 Tmax-10 (ceramic film)Applied by the AI analysis where the rating is in evidence
capacitor_aluminum_temperature_margin_c20 °CQuanterion 2nd ed. Table 2.3-1 p37 Tmax-20Applied by the AI analysis where the rating is in evidence
resistor_power_pct30% (70)Quanterion 2nd ed. Table 2.3-1 p41 film chipApplied by the AI analysis where the rating is in evidence
resistor_working_voltage_pctNot derated by this scheme - the manufacturer's rating is the limitnot stated by this schemeNot applied - the AI is not given this parameter
resistor_temperature_margin_c24 °CQuanterion 2nd ed. Table 2.3-1 p41 film chip Tmax-24Applied by the AI analysis where the rating is in evidence
inductor_continuous_current_pct10% (90)Quanterion 2nd ed. Table 3.12-3 p113 inductor current (DC) 90 % (Severe); s3.12.4 p113 90 % for all magnetics when the hot-spot temperature is not knownApplied by the AI analysis where the rating is in evidence
inductor_surge_current_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. Table 2.3-1 p39 magnetics surge <100 %Not applied - the AI is not given this parameter
inductor_continuous_voltage_pct10% (90)Quanterion 2nd ed. s3.12.4 p113 90 % for all magnetics when the hot-spot temperature is not knownApplied by the AI analysis where the rating is in evidence
inductor_surge_voltage_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. Table 2.3-1 p39 voltage surge <100 %Not applied - the AI is not given this parameter
inductor_dielectric_withstand_voltage_pctNot derated by this scheme - the manufacturer's rating is the limitnot stated by this schemeNot applied - the AI is not given this parameter
inductor_temperature_margin_c25 °CQuanterion 2nd ed. Table 2.3-1 p39 hot spot Tmax-25Applied by the AI analysis where the rating is in evidence
diode_reverse_voltage_pct20% (80)Quanterion 2nd ed. Table 2.3-1 p38 / Table 3.5 p88Applied by the AI analysis where the rating is in evidence
diode_average_forward_current_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. Table 2.3-1 p38 forward current <100 %Not applied - the AI is not given this parameter
diode_power_dissipation_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. Table 2.3-1 p38 HF / Schottky / PIN / TVS rows <100 %Not applied - the AI is not given this parameter
diode_junction_temperature_margin_c35 °CQuanterion 2nd ed. Table 3.20-4 p174 formula 0.75(Tjmax-25)+20 = 115 C at 150 CApplied by the AI analysis where the rating is in evidence
diode_junction_temperature_cap_c115 °CQuanterion 2nd ed. Table 2.3-1 p38 Tj 115 CApplied by the AI analysis where the rating is in evidence
zener_power_dissipation_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. Table 2.3-1 p38 regulator / reference diodes PD <100 %Not applied - the AI is not given this parameter
zener_junction_temperature_margin_c35 °CQuanterion 2nd ed. as diodesApplied by the AI analysis where the rating is in evidence
zener_junction_temperature_cap_c115 °CQuanterion 2nd ed. as diodesApplied by the AI analysis where the rating is in evidence
mosfet_vds_pct20% (80)Quanterion 2nd ed. Table 3.20-4 p174 breakdown VDSApplied by the AI analysis where the rating is in evidence
mosfet_vgs_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. - VGS not listedNot applied - the AI is not given this parameter
mosfet_continuous_current_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. - no current row for transistorsNot applied - the AI is not given this parameter
mosfet_power_dissipation_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. Table 3.20-4 p174 PD <100 %Not applied - the AI is not given this parameter
mosfet_junction_temperature_margin_c35 °CQuanterion 2nd ed. Table 3.20-4 p174 formula (115 C at 150 C)Applied by the AI analysis where the rating is in evidence
mosfet_junction_temperature_cap_c115 °CQuanterion 2nd ed. Table 3.20-4 p174Applied by the AI analysis where the rating is in evidence
bjt_vce_pct20% (80)Quanterion 2nd ed. Table 3.20-4 p174 breakdown VCEApplied by the AI analysis where the rating is in evidence
bjt_continuous_current_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. - no current row for transistorsNot applied - the AI is not given this parameter
bjt_power_dissipation_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. Table 3.20-4 p174 PD <100 %Not applied - the AI is not given this parameter
bjt_junction_temperature_margin_c35 °CQuanterion 2nd ed. as MOSFETApplied by the AI analysis where the rating is in evidence
bjt_junction_temperature_cap_c115 °CQuanterion 2nd ed. as MOSFETApplied by the AI analysis where the rating is in evidence
regulator_input_voltage_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. - microcircuits carry no supply-voltage rowNot applied - the AI is not given this parameter
regulator_output_current_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. Table 2.3-1 p39 linear microcircuits output current <100 %Not applied - the AI is not given this parameter
regulator_power_dissipation_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. Table 2.3-1 p39 linear PD <100 %Not applied - the AI is not given this parameter
regulator_junction_temperature_margin_cNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. Table 3.14-3 p122 states one fixed junction figure and no margin below the maximum of the partNot applied - the AI is not given this parameter
regulator_junction_temperature_cap_c115 °CQuanterion 2nd ed. Table 3.14-3 p122 linear microcircuits Tj 115 C whatever the rating of the partApplied by the AI analysis where the rating is in evidence
ic_output_current_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. Table 2.3-1 p39 output / drive current <100 %Not applied - the AI is not given this parameter
ic_power_dissipation_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. Table 2.3-1 p39 linear PD <100 %Not applied - the AI is not given this parameter
ic_junction_temperature_margin_cNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. Table 3.14-3 p122 states one fixed junction figure and no margin below the maximum of the partNot applied - the AI is not given this parameter
ic_junction_temperature_cap_c115 °CQuanterion 2nd ed. Table 3.14-3 p122 digital and linear microcircuits Tj 115 C whatever the rating of the part (VHLSI 85 C not carried)Applied by the AI analysis where the rating is in evidence
connector_current_per_contact_pct15% (85)Quanterion 2nd ed. Table 2.3-1 p37Applied by the AI analysis where the rating is in evidence
connector_voltage_pctNot derated by this scheme - the manufacturer's rating is the limitQuanterion 2nd ed. - stated as % of dielectric withstand (80 %) not of working voltageNot applied - the AI is not given this parameter
connector_temperature_margin_c25 °CQuanterion 2nd ed. Table 2.3-1 p37 insert Tmax-25Applied by the AI analysis where the rating is in evidence
tvs_junction_temperature_margin_c35 °CQuanterion 2nd ed. as diodesApplied by the AI analysis where the rating is in evidence
tvs_junction_temperature_cap_c115 °CQuanterion 2nd ed. as diodesApplied by the AI analysis where the rating is in evidence

2.3 Part Lifecycle and Silicon Errata

Status as found on the manufacturer's website by the AI enrichment run, on the date shown; the page read is linked. Silicon errata: whether the manufacturer publishes an errata sheet for the part - its presence only. No errata document is read or analysed, and no action is implied by its existence.

ItemLifecycleSilicon errataStatus
U9 (nRF24L01P)Not recommended for new designs, as of 2026-10-02None found on the manufacturer's website, as of 2026-10-02High
D1 (SMBJ33CA)There isn't a life-cycle marking on the datasheet obtained 2026-10-09—
D2, D3, D4 (SK6812)There isn't a life-cycle marking on the datasheet obtained 2026-08-24—
DZ1 (MMSZ5245)There isn't a life-cycle marking on the datasheet obtained 2026-10-02—
Q2 (AON6262E)Active, as of 2026-10-02—
U1 (AP63205WU)There isn't a life-cycle marking on the datasheet obtained 2026-10-02Not determined
U2 (AP63203WU)There isn't a life-cycle marking on the datasheet obtained 2026-10-02Not determined
U3 (US1881)Active, as of 2026-10-02None found on the manufacturer's website, as of 2026-10-02
U4 (LM74700)Active, as of 2026-10-16None found on the manufacturer's website, as of 2026-10-16
U5 (LPS22HBTR)Active, as of 2026-10-02None found on the manufacturer's website, as of 2026-10-02
U6 (LIS2MDLTR)Active, as of 2026-10-02None found on the manufacturer's website, as of 2026-10-02
U7 (STM32F765VITx)There isn't a life-cycle marking on the datasheet obtained 2026-10-02Errata sheet published: STM32F76xxx and STM32F77xxx device errata
U8 (LSM6DSO)Active, as of 2026-10-16None found on the manufacturer's website, as of 2026-10-16
U10 (SN74LV1T34DBV)Active Production, as of 2026-10-02None found on the manufacturer's website, as of 2026-10-02

3 Pin Connectivity Report

3.1 Unconnected Pins

Unconnected pins that are not marked NO_ERC.

21 unconnected pin(s) found:
21 unconnected pin(s) — all are electrical types that are safe to leave open (Bidirectional, Output, Passive, High-Impedance, or Unspecified). Common on partially-populated bus connectors (VME, backplanes, expansion headers) and on outputs whose consumer was omitted. Review to confirm intent, but no action is required by default.
Refdes_PinPin FunctionPin PropertyDevice TypeNet NameNotes
D4_4DOUTOutputSK6812Net-(D4-DOUT)
J5_2Pin_2PassiveConn_01x04_PinTX1
J5_3Pin_3PassiveConn_01x04_PinRX1
R16_2~Passive22 ohmSWDIO
R17_2~Passive22 ohmSWCLK
R18_2~Passive22 ohmSWO
U5_7INT_DRDYBidirectionalLPS22HBTRBAR_INT
U6_2NCUnknownLIS2MDLTR-No net
U6_7INT/DRDY/SDOBidirectionalLIS2MDLTRMAG_INT
U6_11NCUnknownLIS2MDLTR-No net
U6_12NCUnknownLIS2MDLTR-No net
U7_51PB12BidirectionalSTM32F765VITxUART5_RX
U7_52PB13BidirectionalSTM32F765VITxUART5_TX
U7_53PB14BidirectionalSTM32F765VITxUSART1_TX
U7_54PB15BidirectionalSTM32F765VITxUSART1_RX
U7_55PD8BidirectionalSTM32F765VITxUSART3_TX
U7_56PD9BidirectionalSTM32F765VITxUSART3_RX
U7_97PE0BidirectionalSTM32F765VITxUART8_RX
U7_98PE1BidirectionalSTM32F765VITxUART8_TX
U8_4INT1OutputLSM6DSOIMU_INT
U10_1NCUnknownSN74LV1T34DBV-No net

3.2 Implied/Hidden Net Connections

Pins with implied net connections not visible on the schematic. Includes Altium HiddenNetName library parameters and KiCad hidden pins of any electrical type stacked behind visible pins in the symbol.

Implied Net Connections
ComponentTypePinNetStatus
U7STM32F765VITx26 (VSS)GNDFail — hidden pin not visible on schematic
U7STM32F765VITx49 (VSS)GNDFail — hidden pin not visible on schematic
U7STM32F765VITx74 (VSS)GNDFail — hidden pin not visible on schematic
U7STM32F765VITx99 (VSS)GNDFail — hidden pin not visible on schematic

3.3 Open-Collector Pull-up Audit

Examined 0 candidate pin(s) on 0 net(s).

3.4 Diode Polarity / Orientation

Diode polarity and orientation are read from the schematic. IPC-7351B (surface mount) / IPC-7251 (through-hole) Zero Component Orientation (ZCO) requires pin 1, the cathode, on the left with the footprint at zero rotation. Tomachie calls out symbols that do not meet ZCO because the PCB layout may have an error, assembly may insert the part backwards, initial ATE test generation from a netlist of only pins 1 and 2 will fail, or a novice may wrongly indict a correct part — consistency is the least-expensive path for everyone who handles the PCB.
DiodeConnectionsOrientationSeverity
D1
SMBJ33CA
bidirectional · symbol_graphic
Pin 1 (K): GND
Pin 2 (A): Net-(D1-A)
Description says bidirectional, but the symbol has anode/cathode (A/K) pins — verify part/symbolMedium
DZ1
MMSZ5245
unidirectional · pin_names
Pin 1 (K): +BATT
Pin 2 (A): Net-(DZ1-A)
Consistent
D2
SK6812
array · multi-pin
Pin 1 (VSS): GND
Pin 2 (DIN): Net-(D2-DIN)
Pin 3 (VDD): +5V
Pin 4 (DOUT): Net-(D2-DOUT)
4-pin diode package will need to be checked against the datasheet in one of the AI enrichment sections.Information
D4
SK6812
array · multi-pin
Pin 1 (VSS): GND
Pin 2 (DIN): Net-(D3-DOUT)
Pin 3 (VDD): +5V
Pin 4 (DOUT): Net-(D4-DOUT)
4-pin diode package will need to be checked against the datasheet in one of the AI enrichment sections.Information
D3
SK6812
array · multi-pin
Pin 1 (VSS): GND
Pin 2 (DIN): Net-(D2-DOUT)
Pin 3 (VDD): +5V
Pin 4 (DOUT): Net-(D3-DOUT)
4-pin diode package will need to be checked against the datasheet in one of the AI enrichment sections.Information

3.5 Polarized Capacitor Orientation

Aluminum-electrolytic, tantalum, and polymer capacitors are polarized: pin 1 is the positive (+) terminal. IPC-7351B (surface-mount) and IPC-7251 (through-hole) fix pin 1 as positive in the land pattern — the square pad, the silkscreen "+", and (through-hole) the notch or plated hole all mark it. Footprint selection, pick-and-place assembly, and in-circuit / flying-probe test all reference pin 1, so the schematic symbol's pin 1 MUST match: pin 1 = positive. If a symbol instead draws "+" on pin 2, pin 1 — the footprint's positive pad — is wired to the wrong net and the assembled part sits backwards. (The part's own body marking is not a reliable guide: aluminum electrolytics stripe the NEGATIVE lead, tantalums mark the POSITIVE — so the land-pattern pin 1 = positive is the fixed reference.) Each polarized capacitor below is checked against this convention.
CapacitorConnectionsPolaritySeverity
C48Pin 1 (+): +5V
Pin 2: GND
C11Pin 1 (+): GND
Pin 2: +BATT
Pin 1 is the positive terminal per IPC-7351B/7251 (square pad, silkscreen "+") but it is on GND — the assembled part will be reversed. The symbol most likely draws "+" on pin 2; correct it so pin 1 is positive.High

3.6 Power Symbols That Connect Nothing

1 power symbol placement(s) connect nothing: the placed symbol has no library definition in the schematic file, or its definition has no power pin. A power symbol joins all same-named rails across the design; an inert one leaves them separate. Where the last column lists more than one net, those nets were meant to be one rail and are NOT connected. Restore the power symbol's library definition (re-place it from a maintained library) and verify the rails merge.
Power NetLibrary CellPlacementsNets Left Separate
Logo_Open_Hardware_LargeGraphic:Logo_Open_Hardware_Large1 (caiman.kicad_sch)-

3.7 Checks Not Performed

Items this report did not check, with the reason. None of these is a finding against the design - an item that was not checked says nothing about it either way.

Note 3: The figure these checks need was not taken from the part's datasheet, so they were not performed. This is a limitation of the analysis, not a finding on the design.

Checks the AI review could not perform are listed at Review severity in each AI section's Findings table, each naming the input that was missing.

ItemNot checkedNotes
Part Number vs Stated ValuesThe part-number cross-check could not be performed: no part-number property is populated on the passive components. The AI-enriched run resolves part identities and enables this check.
Capacitors and resistors (datasheets and parameter curves)Datasheets for capacitors and resistors, and the parameter curves they carry (ripple current, derating against temperature, DC bias, a jumper's temperature rise), are obtained on the premium tier only. This standard-tier run reads a datasheet already on file and otherwise states no rating for these parts. The exception is a capacitor on a regulator's input or output rail: this tier obtains its datasheet and curves as well.
U1 (AP63205WU)Loop stability limit with 470 µF electrolytic in parallel with the ceramic output capacitors (maximum output capacitance and ESR range for internal compensation)See note 3
D1 (SMBJ33CA)Breakdown voltage against the J7 charge-input voltage (VBR minimum for the 33CA variant)See note 3
U7 (STM32F765VITx)SDMMC peripheral alternate-function assignment of PC8, PC9, PC10, PC11, PC12 and PD2 (alternate function mapping table)See note 3
U7 (STM32F765VITx)Maximum SDMMC clock frequency against the card bus speed (SDMMC_CK maximum frequency)See note 3
U8 (LSM6DSO)I2C slave address selected by SDO/SA0 tied to GND, and its uniqueness on I2C2 (7-bit I2C address for SA0 = 0)See note 3
U6 (LIS2MDLTR)I2C slave address and its uniqueness on I2C2 (7-bit I2C address)See note 3
U7 (STM32F765VITx)BOOT0 level that selects boot from main flash (BOOT0 boot-mode table)See note 3
U7 (STM32F765VITx)ESD robustness of PD12, PD13, PB6, PB7, PB10, PB11, PA11, PA12, PE7 and PE8 against discharges entering unprotected on J1, J2, J3, J4, J10, J11 and J12 (ESD HBM/CDM rating of I/O pins)See note 3
U7 (STM32F765VITx)Current into U7_16 PC1 through R6 100 kΩ during transients on J7, and series resistor sizing on the unprotected connector pins (Injected current limit IINJ per I/O pin)See note 3
U9 (nRF24L01P)Withstand of U9_12 ANT1 and U9_13 ANT2 to discharges coupled from J14 through C38 (ESD HBM rating of the RF pins)See note 3

3.8 Summary

Total NO_ERC markers in design51
Pins needing attention (warnings)21
Pins for information only0

4 Power Overview

Power rails5
Power management sources identified5
Analysis of passive component footprint suitability, voltage ratings, and power dissipation is not performed in this revision.
Power architecture overview. For test point coverage, see Design-for-Test section.

4.1 Power Rail Analysis

Power Rails
RailVoltageSourceConsumers
+5V5.00VU1
AP63205WU
U10 (SN74LV1T34DBV),
U2 (AP63203WU)
+3V33.30VU2
AP63203WU
U5 (LPS22HBTR),
U6 (LIS2MDLTR),
U8 (LSM6DSO),
U9 (nRF24L01P)
+BATT-J8
External
U3 (US1881),
U4 (LM74700)
GND-U8
LSM6DSO
-
VCC-J9
External
U1 (AP63205WU)

4.1.1 Rail Voltage Annotation

2 power input(s) into this board were identified - the supplies it takes in at a connector, a terminal or a module socket. Every part on and downstream of each one is judged against what it carries, so the analysis needs its full characterization: whether it is AC or DC, its nominal voltage, the band it operates over, and any level outside normal operation the design must survive.
The preferred way to state a rail's voltage is to record it in the design itself, where it travels with the schematic, survives every re-run, and can be read by anyone who opens the design: add VOLTAGE_NOM, VOLTAGE_MIN and VOLTAGE_MAX properties to the rail's net class directive, and VOLTAGE_EXCURSION_MAX for a survivable level outside normal operation.
You will be prompted to enter each input's nominal, minimum and maximum operating voltage - and, where one exists, the survivable excursion level - before the AI review starts.
RailRequired information
+BATTState whether this input is AC or DC, its nominal voltage, and the minimum and maximum it operates over. For example: DC, nominal 5.0 V, minimum 4.75 V, maximum 5.25 V; or for a battery, DC, minimum 3.0 V, maximum 4.2 V. If it can reach a higher sustained level outside normal operation - a charging overvoltage or a jump-start the design must survive but need not function at - state that separately as the excursion maximum; it is never treated as an operating voltage.
VCCState whether this input is AC or DC, its nominal voltage, and the minimum and maximum it operates over. For example: DC, nominal 5.0 V, minimum 4.75 V, maximum 5.25 V; or for a battery, DC, minimum 3.0 V, maximum 4.2 V. If it can reach a higher sustained level outside normal operation - a charging overvoltage or a jump-start the design must survive but need not function at - state that separately as the excursion maximum; it is never treated as an operating voltage.

4.2 Regulator Enable Pull Resistors

3 regulator enable pin(s) examined for what drives them and which way they are pulled. 0 pulled toward the enabling level while a power output drives the net.
FindingSeverity
RegulatorU2 [AP63203WU]
Enable pinU2_2 (EN) (enabled high)
Net+5V
Driven by-
Pull-up-
Pull-down-
The enable is wired to +5V; the regulator is always enabled.Information
RegulatorU4 [LM74700]
Enable pinU4_3 (EN) (enabled high)
NetNet-(D1-A)
Driven byJ7_2 (Pin_2), R6 -> VCHG
Pull-up-
Pull-down-
Driven by the pins listed; no pull resistor is fitted.Information
RegulatorU1 [AP63205WU]
Enable pinU1_2 (EN) (enabled high)
NetNet-(U1-EN)
Driven by-
Pull-upR1 100k -> VCC
Pull-down-
No driver on the net; the pull resistor sets the level.Information

4.3 AI-Assisted Analysis

This section is created by AI and should be reviewed for accuracy. There may be some incorrect analysis, especially if any errors are called out in the Design Summary or Component Value sections. STANDARD MODE — this analysis was produced by the standard model tier.

4.3.1 Power Tree Overview

AI-Assisted — The battery enters on J8 (XT60) as +BATT. A charger plugged into J7 (XT30) reaches +BATT through an ideal-diode stage: U4 (LM74700) drives N-channel MOSFET Q2 (AON6262E). The bidirectional TVS D1 (SMBJ33CA) and C9 (0.1 µF) sit on the J7 side, on net Net-(D1-A).

+BATT feeds the Hall switch U3 (US1881), the R4/R5 battery-sense divider into U7_15 PC0, and the source of P-channel MOSFET Q1. Q1 is the magnetic on/off switch. Its drain is VCC, which leaves the board on J9 (XT60, ESC power) and feeds U1 (AP63205WU, fixed 5 V buck).

+5V supplies the SK6812 LEDs D2 to D4, the level shifter U10, the off-board headers J2, J3 and J5, and the input of U2 (AP63203WU, fixed 3.3 V buck). +3V3 supplies U5, U6, U8, U9, the SD socket J13 and the I2C headers J10 to J12. It is also intended to supply the MCU U7, but those supply pins are not connected to it (see the MCU supply subsection). The charge input is sensed by R6/R7 into U7_16 PC1.

Neither the battery voltage on +BATT/VCC nor the charger voltage on J7 is stated anywhere in the schematic. Every rating on those nets therefore remains open. No series fuse is drawn on J8 or J7; that protection is expected in the battery lead and the charger harness.

The power-up order is:
Battery connected at J8: +BATT rises, U3 is powered, and R3 holds Q1 off.
Magnet present: U3_3 sinks Net-(DZ1-A), Q1 turns on, and VCC and J9 come up.
U1_2 EN is already high through R1 and its internal pull-up. U1 starts above its 3.5 V typical rising UVLO and ramps +5V over its 4 ms soft-start.
U2 has EN and VIN both on +5V. It starts once +5V passes its 3.70 V maximum rising UVLO, which is during U1's soft-start, and ramps +3V3 over 4 ms.

4.3.2 Charge Input Ideal Diode (U4, Q2, D1)

AI-Assisted — U4 ANODE and EN share Net-(D1-A), so the controller is always enabled when a charger is present. The LM74700 datasheet (Texas Instruments, source: Tomachie) shows EN tied to ANODE for always-on operation.

Q2 is oriented as the datasheet requires: its source is on ANODE, its drain on CATHODE (+BATT) and its gate on GATE. Its body diode therefore conducts from J7 toward the battery. When the charger is removed or shorted, U4 blocks reverse current from the battery within 0.75 µs maximum.

The gate drive sits at VCAP minus ANODE. It is capped by the charge-pump turn-off level of 13.9 V maximum, below the AON6262E VGS rating of ±20 V (Alpha & Omega datasheet). This also satisfies the LM74700 requirement for a MOSFET VGS rating of at least 15 V.

C10 (0.1 µF) runs from VCAP to ANODE. That meets the 0.1 µF minimum and is well above 10 × Ciss: AON6262E Ciss is 1650 pF, so 10 × Ciss is 16.5 nF. C9 (0.1 µF) exceeds the 22 nF minimum input capacitance, and C11 (47 µF) on CATHODE exceeds the 0.1 µF minimum output capacitance.

D1 is the optional SMBJ33CA shown in the datasheet's 12 V application, placed at the point of entry on J7. The protected parts tolerate the following: U4 ANODE to ground ±65 V absolute maximum, and Q2 VDS 60 V. The SMBJ33CA clamping voltage is not in the data. D1 is a bidirectional part drawn with a symbol that uses anode/cathode pin names; either orientation is electrically correct.

Q2 conduction loss and junction temperature need the charge current through J7, which the schematic does not state.

4.3.3 Magnetic Power Switch (Q1, U3, DZ1)

AI-Assisted — Q1 is a high-side P-channel switch. R3 (10 kΩ) ties the gate net Net-(DZ1-A) to +BATT, which holds Q1 off. U3 OUTPUT is an open-drain stage that pulls the gate net low when a magnetic field is present. The 10 kΩ pull-up matches the US1881 typical application (Melexis datasheet, page 10).

DZ1 (MMSZ5245, 15 V) has its cathode on +BATT (the source) and its anode on the gate. That orientation is consistent and limits Q1 VGS to the zener voltage: 14.25 to 15.75 V at 8.5 mA (onsemi datasheet).

While U3 is asserted, VGS equals +BATT minus U3's output saturation of 0.5 V maximum at 20 mA. Nothing limits current between DZ1 and U3_3. If +BATT exceeds 14.25 V, DZ1 conducts from +BATT directly into the U3 output, and the current is bounded only by that output stage. U3's absolute maximum output current is 50 mA. Whether this happens depends on the battery voltage, which is not stated.

Q1 carries no part number, so its VDS, VGS and drain-current ratings are unknown. That matters because Q1 carries the whole ESC current on J9 as well as U1's input.

U3 is powered from +BATT at all times. Its recommended supply range is 3.5 to 24 V (absolute maximum 28 V), and it draws up to 5 mA permanently, whether Q1 is on or off. Its only bypass is the 47 µF electrolytic C11; the datasheet application circuit places 100 nF close to the device.

R2 (15 kΩ, VCC to GND) bleeds VCC and J9 down once Q1 opens.

4.3.4 AP63205WU 5 V Buck (U1)

AI-Assisted — U1_3 IN is on VCC and U1_4 GND is on GND, so both have a DC path. FB senses +5V directly, as the fixed-output part requires, giving 4.95 to 5.05 V (Diodes Inc. AP63205 datasheet, source: Tomachie, page 5).

C1 (100 nF) is connected between BST and SW as required. L1 is 3.3 µH, inside the datasheet's approximate 2.2 to 10 µH range; Table 3 uses 4.7 µH.

The only input capacitor is C3, 10 µF in 0603, equal to the Table 3 value. The text recommends more than 10 µF for most applications. C3's voltage rating is not stated, and its DC-bias loss at the unknown battery voltage is not applied.

The output capacitance on +5V is 2 × 22 µF plus 10 µF ceramic, plus the 470 µF electrolytic C48, plus 4 × 0.1 µF, for 524.4 µF nominal. DC-bias loss on the ceramics is not applied. The datasheet calls 22 to 68 µF ceramic sufficient for most applications and states no upper limit. However, the LC corner moves from about 13.2 kHz (3.3 µH with 44 µF) to about 3.8 kHz with C48 fitted. The internally compensated loop has not been characterised with that capacitance.

Soft-start current into the output is 524.4 µF × 5 V / 4 ms = 0.66 A, well below the 2.5 A minimum high-side current limit.

The known +5V load is about 0.155 A:
- U2 input current, 0.152 A, using U2's estimated 90 % efficiency.
- SK6812 static current, 3 × 1 mA.

This excludes the LED colour drive current and the off-board loads on J2, J3 and J5. The total is well inside the 2 A rating. U1's dissipation, its inductor ripple and L1's peak current all depend on the VCC input voltage, which is not stated.

4.3.5 AP63203WU 3.3 V Buck (U2)

AI-Assisted — U2_3 IN is on +5V and U2_4 GND is on GND. EN sits on +5V for automatic start-up, and FB senses +3V3 directly, giving 3.27 to 3.33 V (Diodes Inc. datasheet, page 5). C2 (100 nF) is connected between BST and SW.

The input on +5V has C6 (10 µF) plus C4 and C5 (22 µF each) and C48. That covers the 10 µF reference input capacitor.

L2 is 2.2 µH, where Table 2 uses 3.9 µH. At 5 V in, 3.3 V out and 1.1 MHz, the ripple is ΔIL = 3.3 × (1 − 3.3/5) / (2.2 µH × 1.1 MHz) = 0.464 A peak-to-peak. With 3.9 µH it would be 0.262 A.

The output capacitance (caps_to_gnd) totals 74.111 µF nominal, mostly C7 and C8 (22 µF each) and C30 and C44 (10 µF each). That is above the datasheet's 22 to 68 µF sufficiency range; DC-bias loss is not applied.

The known +3V3 load is about 0.207 A, assuming U7 is rewired:
- U7: 193 mA typical at 216 MHz with all peripherals enabled.
- U9: 13.5 mA in RX.
- U8: 0.55 mA.
- U6: 0.2 mA.
- U5: 12 µA.

This excludes the SD card on J13 and the modules on J10 to J12. L2's peak current is then 0.207 + 0.232 = 0.44 A.

The manufacturer's example curve (VIN = 12 V, VOUT = 3.3 V, AP63200, page 6) reads 90.0 % efficiency at 0.207 A. That gives about 76 mW of loss. With θJA of 89 °C/W, the estimated junction temperature is 40 + 6.8 = 46.8 °C.

4.3.6 MCU Supply Connection and Load Decoupling

AI-Assisted — Every U7 supply pin other than VCAP is wired in series with its decoupling capacitor instead of having the capacitor shunted to ground:
- U7_50 VDD connects only to C12 pin 1, whose pin 2 is on +3V3.
- U7_27, U7_11, U7_100 and U7_75 have the same arrangement through C13, C15, C16 and C18.
- U7_21 VDDA connects through C14.
- U7_6 VBAT connects through C17.
- U7_20 VREF+ connects through C19 and C21.

None of these pins has a DC path to any supply, so the STM32F765 receives no power. Its only connection to +3V3 is through the pull-ups on its I/O, such as R8 on NRST. The fix is to tie each pin net to +3V3 and return the capacitor's other terminal to GND. That arrangement gives the 100 nF per VDD/VSS pair called for in the STMicroelectronics datasheet (Datasheet, page 106).

After that rework, VDDA would have only C14. The datasheet lists 100 nF plus 1 µF between VDDA and VSSA, and the 1 µF part on the board (C21) is placed on VREF+. VCAP_1 and VCAP_2 are correct: each has 2.2 µF to GND (C42, C45).

The other loads meet their datasheet decoupling:
- U9 has 10 nF (C33) and 1 nF (C34) on +3V3, with 4.7 µF bulk available on the rail. DVDD has 33 nF (C41). VDD_PA has 2.2 nF (C35) and 4.7 pF (C36), matching the Nordic reference circuit (Datasheet).
- U6 has 220 nF (C29) on C1.
- U5, U6 and U8 share the 100 nF parts on +3V3.
- The four 0.1 µF capacitors on +5V (C47, C49, C50, C51) provide the 100 nF per SK6812 shown in that datasheet's application circuit.

4.4 Observations

AI-Assisted — The decisive defect is the series-wired MCU decoupling, which leaves U7 unpowered; nothing on the board works until it is corrected.

The second structural gap is that no battery voltage or charger voltage is stated. These parts can only be judged once that voltage is known:
- U3: 24 V recommended supply.
- U1: 32 V recommended input (35 V absolute maximum).
- Q2: 60 V VDS, which is 48 V under the Benign (controlled office) derating selected for this schematic analysis (mosfet_vds_pct = 80).
- DZ1: its 14.25 V minimum breakdown, which decides whether it conducts into U3 when Q1 is on.
- The two sense dividers: with a ratio of 0.2126 and VREF+ at 3.3 V, their full scale is 15.52 V.

No capacitor on the board carries a voltage rating. Under the selected derating:
- On +5V, a ceramic needs at least 7.2 V rating (5.05 V / 0.7), and the electrolytic C48 at least 6.3 V (5.05 V / 0.8). A 10 V or higher part covers both.
- On +3V3, a 6.3 V ceramic is sufficient.

VCC is exposed to ESC switching transients through J9, with only C3 and C11 as filtering. Q1 is a generic symbol with no part number, so it cannot be rated against the ESC current.

4.5 Findings

AI-Assisted —
#DeviceRailObservationSeverity
4.5.1U7 (STM32F765VITx), C12, C13, C14, C15, C16, C17, C18, C19, C21+3V3U7_11, U7_27, U7_50, U7_75, U7_100 VDD, U7_21 VDDA, U7_6 VBAT and U7_20 VREF+ each sit on a net whose only other member is a capacitor plate; that capacitor's other plate is on +3V3. No supply pin has a DC path, so the MCU is unpowered. Rework: connect each pin net to +3V3 and move each capacitor's +3V3 plate to GND. This gives 100 nF per VDD/VSS pair (STMicroelectronics datasheet p.106).High
4.5.2+BATT, VCC (J8, J9)+BATT, VCCThe battery voltage entering on J8 is not specified, so these ratings cannot be checked against it: Q2 VDS 60 V (48 V under mosfet_vds_pct = 80), U4 CATHODE 60 V recommended, U3 VDD 24 V recommended, U1 VIN 32 V recommended, and C3 and C11. Annotate +BATT with a net class stating the battery voltage.Medium
4.5.3Net-(D1-A) (J7)Net-(D1-A)The charger voltage entering on J7 is not specified, so these cannot be checked against it: D1 working voltage, U4 ANODE 60 V recommended, Q2, C9 and C10. Annotate the net with a net class stating the charge voltage.Medium
4.5.4U7 (STM32F765VITx)+3V3After the rework, VDDA has only C14 (100 nF). The datasheet (p.106) lists 100 nF plus 1 µF between VDDA and VSSA; the board's 1 µF part, C21, is placed on VREF+. Add 1 µF on VDDA.Review
4.5.5U1, C3VCCThe input capacitor is C3, 10 µF in 0603. That equals the Table 3 value, while the text recommends more than 10 µF ceramic for most applications. Its voltage rating is not stated, and DC-bias loss at the unknown battery voltage is not applied.Review
4.5.6U1, C4, C5, C6, C48+5VOutput capacitance is 2 × 22 µF + 10 µF ceramic + 470 µF electrolytic (C48) + 4 × 0.1 µF = 524.4 µF nominal, against the 22 to 68 µF ceramic the datasheet calls sufficient (p.14). C48 lowers the L1 output corner from about 13.2 kHz to about 3.8 kHz in an internally compensated loop. Measure the +5V load-step response with C48 fitted.Review
4.5.7U2, L2+3V3L2 is 2.2 µH; Table 2 of the AP63203 datasheet (p.13) uses 3.9 µH. Ripple is 3.3 × (1 − 3.3/5) / (2.2 µH × 1.1 MHz) = 0.464 A peak-to-peak, against 0.262 A with 3.9 µH.Review
4.5.8L1, L2+5V, +3V3Neither inductor states a current rating. Isat must be judged against the maximum high-side current limit of 3.1 A (AP63203/AP63205 datasheet p.5). The L2 peak at the known load is 0.44 A; the L1 peak depends on the VCC voltage. Add Isat and Irms properties.Review
4.5.9U1VCCDissipation and junction temperature are not computed because the VCC input voltage is not stated.Review
4.5.10U2+3V3U2 is rated 2 A. The known load is 0.207 A: U7 193 mA once rewired, U9 13.5 mA, U8 0.55 mA, U6 0.2 mA, U5 12 µA. This excludes J13 and J10 to J12. Check that the total stays below 2 A.Review
4.5.11U1+5VU1 is rated 2 A. The known load is 0.155 A: U2 input 0.152 A and SK6812 static current 3 mA. This excludes the LED colour current and the J2, J3 and J5 off-board loads. Check that the total stays below 2 A.Review
4.5.12D1 (SMBJ33CA)Net-(D1-A)D1 protects U4 ANODE (65 V absolute maximum, LM74700 p.5) and Q2 VDS (60 V, AON6262E p.1). Check that D1's maximum clamping voltage at its surge current stays below 60 V. The SMBJ33CA clamping voltage was not available at report generation time.Review
4.5.13D1 (SMBJ33CA)Net-(D1-A)D1 is a bidirectional TVS, so either orientation is correct. Its symbol uses unidirectional K/A pin names; use a bidirectional symbol.Review
4.5.14Q2 (AON6262E)Net-(D1-A), +BATTThe J7 charge current through Net-(D1-A) cannot be calculated, so Q2 conduction loss and junction temperature are not checked. It can be stated with free text on the schematic page as: Net-(D1-A) load current : <value>.Review
4.5.15Q1+BATT, VCCQ1 has no part number or value on the schematic. State it so VDS, VGS and drain current can be checked against +BATT and the ESC load on J9.Review
4.5.16DZ1, U3, Q1Net-(DZ1-A)DZ1 orientation is consistent (cathode at +BATT). With U3_3 asserted, Q1 VGS = +BATT − 0.5 V, limited by DZ1 to 14.25 to 15.75 V. Above 14.25 V, DZ1 conducts into U3_3 with no series resistor, bounded only by U3's 50 mA absolute-maximum output current (p.6). If the battery can exceed 14.25 V, add a resistor between U3_3 and Net-(DZ1-A) that limits the current to U3's 20 mA VOL condition, and keep the R3 divider ratio above Q1's full-enhancement VGS.Review
4.5.17U3 (US1881)+BATTThe only bypass is C11, a 47 µF electrolytic. The US1881 application circuit (p.10) places 100 nF close to the device.Review
4.5.18U3, R4, R5+BATTU3 draws up to 5 mA (p.7) from the battery permanently, whether Q1 is on or off, in addition to the R4/R5 divider. This is a continuous drain with the vehicle switched off.Review
4.5.19R4/R5, R6/R7+BATT, Net-(D1-A)The VBAT (to U7_15 PC0) and VCHG (to U7_16 PC1) dividers both have a ratio of 0.2126, giving 15.52 V full scale with VREF+ at 3.3 V. Check that the maximum battery and charger voltages stay below 15.52 V.Review
4.5.20R2, R3VCC, +BATTNo power rating is stated for either 0603 resistor. At the conventional 0.1 W, resistor_power_pct = 70 permits 70 mW, reached by R2 (15 kΩ) at 32.4 V and by R3 (10 kΩ, while U3 holds the gate low) at 26.5 V. State their power ratings.Review
4.5.21C4, C5, C6, C47, C48, C49, C50, C51+5VVoltage rating not stated in the schematic data. At 5.05 V, a ceramic must be rated at least 7.2 V (capacitor_voltage_pct = 70) and the electrolytic C48 at least 6.3 V (80 %). State 10 V or higher in a Voltage property.Review
4.5.22C7, C8, C22, C23, C25, C26, C27, C30, C31, C32, C33, C34, C40, C43, C44+3V3Voltage rating not stated in the schematic data. At 3.33 V, a ceramic must be rated at least 4.76 V (capacitor_voltage_pct = 70); 6.3 V or higher is sufficient. State it in a Voltage property.Review
4.5.23C3, C11, C9, C10VCC, +BATT, Net-(D1-A)Voltage rating not stated in the schematic data for capacitors on the battery and charger nets.Review
4.5.24VCC (J9)VCCNo transient suppressor is fitted on VCC where the ESC connects at J9; only C3 and C11 filter it. U1 VIN is rated 35 V DC and 40 V for 400 ms absolute maximum (AP63205 p.4). Consider a clamp on VCC rated against those limits.Review
4.5.25U7, C42, C45Net-(U7-VCAP_1), Net-(U7-VCAP_2)U7_48 VCAP_1 and U7_73 VCAP_2 each have 2.2 µF to GND (C42, C45), as required with the internal regulator on (STMicroelectronics datasheet p.106, p.112).✓
4.5.26U1 (AP63205WU)VCC / GNDU1_3 IN is on VCC, fed from +BATT through Q1; U1_4 GND is on GND. Both have a DC path.✓
4.5.27U2 (AP63203WU)+5V / GNDU2_3 IN is on +5V, the output of U1; U2_4 GND is on GND. Both have a DC path.✓
4.5.28U1 (AP63205WU)+5VFB connects directly to +5V as the fixed-output part requires; output 4.95 to 5.05 V (Diodes Inc. AP63205 datasheet p.5).✓
4.5.29U2 (AP63203WU)+3V3FB connects directly to +3V3; output 3.27 to 3.33 V (Diodes Inc. AP63203 datasheet p.5).✓
4.5.30U1, C1Net-(U1-BST)C1 100 nF ceramic is connected between U1_6 BST and U1_5 SW, as required (AP63205 datasheet).✓
4.5.31U2, C2Net-(U2-BST)C2 100 nF is connected between U2_6 BST and U2_5 SW, as required (AP63203 datasheet p.14).✓
4.5.32U1, R1VCCU1_2 EN is pulled to VCC through R1 100 kΩ, alongside the internal 1.5 µA pull-up. The datasheet permits EN tied to VIN or left open for automatic start-up (AP63205 datasheet p.2, p.10-11).✓
4.5.33U2+5VU2_2 EN is tied to +5V for automatic start-up (AP63203 datasheet p.2).✓
4.5.34U2, C6, C4, C5+5VU2 input has C6 10 µF plus C4 and C5 22 µF and C48 470 µF on +5V, covering the 10 µF reference input capacitor (AP63203 datasheet p.13).✓
4.5.35U2, C7, C8, C30, C44+3V3Output capacitance is 74.111 µF nominal, above the 22 to 68 µF sufficiency range (AP63203 datasheet p.14). DC-bias loss is not applied.✓
4.5.36U1, L1+5VL1 3.3 µH is inside the approximate 2.2 to 10 µH range (AP63205 datasheet p.13); Table 3 uses 4.7 µH.✓
4.5.37U1+5VSoft-start current into the output is 524.4 µF × 5 V / 4 ms = 0.66 A, below the 2.5 A minimum high-side current limit (AP63205 datasheet p.5).✓
4.5.38U2+3V3Estimated junction temperature is 46.8 °C: 90.0 % efficiency at 0.207 A read from the manufacturer's example curve Efficiency vs. Output Current, VIN = 12V, VOUT = 3.3V (AP63200, p.6), about 76 mW loss, and θJA 89 °C/W. This is below the 115 °C limit of the Benign (controlled office) derating.✓
4.5.39U4, C9Net-(D1-A)C9 0.1 µF from ANODE to GND meets the 22 nF minimum input capacitance (LM74700 datasheet p.17).✓
4.5.40U4, C10Net-(U4-VCAP)C10 0.1 µF from VCAP to ANODE meets the 0.1 µF minimum and the 10 × Ciss requirement: AON6262E Ciss 1650 pF gives 16.5 nF (LM74700 p.17).✓
4.5.41U4, C11+BATTC11 47 µF on CATHODE meets the 0.1 µF minimum output capacitance (LM74700 p.17).✓
4.5.42U4Net-(D1-A)U4_3 EN is tied to ANODE for always-on operation, which the datasheet permits (LM74700 p.3, p.11).✓
4.5.43Q2 (AON6262E), U4Net-(Q2-G)Q2 source is on ANODE, drain on CATHODE and gate on U4 GATE (LM74700 p.3). The applied VGS is at most the 13.9 V charge-pump turn-off level (p.7), within the ±20 V VGS rating and the at-least-15 V rating requirement.✓
4.5.44U3 (US1881), R3Net-(DZ1-A)The R3 10 kΩ pull-up from U3_3 OUTPUT to +BATT matches the 10 kΩ pull-up in the US1881 application circuit (Melexis datasheet p.10).✓
4.5.45U9 (nRF24L01P), C33, C34, C41, C35, C36+3V3VDD has 10 nF (C33) and 1 nF (C34) plus 4.7 µF on the rail, DVDD has 33 nF (C41), and VDD_PA has 2.2 nF (C35) and 4.7 pF (C36), matching the Nordic reference circuit (p.66-67).✓
4.5.46U6 (LIS2MDLTR), C29Net-(U6-C1)U6_5 C1 has 220 nF (C29) to GND, as required (ST datasheet p.13).✓
4.5.47D2, D3, D4 (SK6812), C47, C49, C50, C51+5VThere are four 0.1 µF capacitors on +5V for three LEDs and U10, matching the 100 nF per LED in the SK6812 application circuit (p.7).✓
4.5.48U2+5VU2's 3.70 V maximum rising UVLO (p.5) is below U1's 4.95 V minimum output, so +3V3 starts reliably during U1's soft-start.✓

4.6 Citations

AI-Assisted —
References
AON6262E (Alpha & Omega Semiconductor (AOS)) — datasheet
www.aosmd.com/sites/default/files/res/datasheets/AON6262E...
AP63203 (Diodes Incorporated) — datasheet
www.mouser.com/datasheet/2/115/AP63200_AP63201_AP63203_AP...
MMSZ5245 (onsemi) — datasheet
www.mouser.com/datasheet/2/308/MMSZ5221ET1_D-1773609.pdf
SK6812 (LED COLOR (www.szledcolor.com)) — datasheet
cdn-shop.adafruit.com/product-files/1138/SK6812+LED+datas...
SMBJ (Kyocera AVX) — datasheet, cited pages 1,2,3
datasheets.kyocera-avx.com/tvsdiodes.pdf
STM32F765VI (STMicroelectronics) — datasheet
www.st.com/resource/en/datasheet/stm32f765vi.pdf
US1881 (Melexis) — datasheet
www.mouser.com/datasheet/2/734/US1881_Datasheet_Melexis-2...
nRF24L01P (Nordic Semiconductor ASA) — datasheet
datasheet.lcsc.com/datasheet/pdf/1f70bc6ad7df407cb308db24...

5 Connector Pinouts

Total connectors15

5.1 J1 Conn_01x03_Pin

J1 - Conn_01x03_Pin
PinPin NameNetNotes
1Pin_1GND
2Pin_2NC
3Pin_3THRR

5.2 J2 Conn_01x04_Pin (I2C)

J2 - Conn_01x04_Pin (I2C)
PinPin NameNetNotes
1Pin_1+5V
2Pin_2UART7_TX
3Pin_3UART7_RX
4Pin_4I2C2_SCL
5Pin_5I2C2_SDA
6Pin_6GND

5.3 J3 Conn_01x04_Pin (UART)

J3 - Conn_01x04_Pin (UART)
PinPin NameNetNotes
1Pin_1+5V
2Pin_2UART4_TX
3Pin_3UART4_RX
4Pin_4GND

5.4 J4 Conn_01x03_Pin

J4 - Conn_01x03_Pin
PinPin NameNetNotes
1Pin_1GND
2Pin_2NC
3Pin_3THRL

5.5 J5 Conn_01x04_Pin

J5 - Conn_01x04_Pin
PinPin NameNetNotes
1Pin_1+5V
2Pin_2TX1
3Pin_3RX1
4Pin_4NC
5Pin_5NC
6Pin_6GND

5.6 J6 Conn_01x04_Pin

J6 - Conn_01x04_Pin
PinPin NameNetNotes
1Pin_1NC
2Pin_2NC
3Pin_3NC
4Pin_4NC
5Pin_5NC
6Pin_6NC

5.7 J7 Conn_01x02_Pin

J7 - Conn_01x02_Pin
PinPin NameNetNotes
1Pin_1GND
2Pin_2Net-(D1-A)

5.8 J8 Conn_01x02_Pin

J8 - Conn_01x02_Pin
PinPin NameNetNotes
1Pin_1GND
2Pin_2+BATT

5.9 J9 Conn_01x02_Pin

J9 - Conn_01x02_Pin
PinPin NameNetNotes
1Pin_1GND
2Pin_2VCC

5.10 J10 Conn_01x04_Pin (I2C)

J10 - Conn_01x04_Pin (I2C)
PinPin NameNetNotes
1Pin_1+3V3
2Pin_2I2C2_SCL
3Pin_3I2C2_SDA
4Pin_4GND

5.11 J11 Conn_01x04_Pin (I2C)

J11 - Conn_01x04_Pin (I2C)
PinPin NameNetNotes
1Pin_1+3V3
2Pin_2I2C1_SCL
3Pin_3I2C1_SDA
4Pin_4GND

5.12 J12 Conn_01x04_Pin (I2C)

J12 - Conn_01x04_Pin (I2C)
PinPin NameNetNotes
1Pin_1+3V3
2Pin_2I2C2_SCL
3Pin_3I2C2_SDA
4Pin_4GND

5.13 J13 Micro_SD_Card

J13 - Micro_SD_Card
PinPin NameNetNotes
1DAT2DAT2
2DAT3/CDDAT3
3CMDCMD
4VDD+3V3
5CLKCLK
6VSSGND
7DAT0DAT0
8DAT1DAT1
9DETSD_Detect
10SHIELDGND

5.14 J14 50 ohm

J14 - 50 ohm
PinPin NameNetNotes
1InAntenna
2ExtGND

5.15 J15 Conn_01x03_Pin

J15 - Conn_01x03_Pin
PinPin NameNetNotes
1Pin_1NC
2Pin_2NC
3Pin_3NC

6 Indicator Documentation

3 indicator device(s) found.

6.1 Indicator Assignments

Indicators
RefDesTypeColorSignalSheetNotes
D2SK6812RGBNet-(D2-DIN)caiman.kicad_schSmart LED (serial), chain D2 -> D4, position 1 of 3
D4SK6812RGBNet-(D3-DOUT)caiman.kicad_schSmart LED (serial), chain D2 -> D4, position 3 of 3
D3SK6812RGBNet-(D2-DOUT)caiman.kicad_schSmart LED (serial), chain D2 -> D4, position 2 of 3

6.2 Indicator Testability

Bed-of-nails or flying probe access was not selected. Test point recommendations for indicators will not be applied.

7 Switch Documentation

No switches or push buttons found in design.

8 Low-Speed Serial Interfaces (LSSI)

Detected: 2 I2C, 1 SPI, 2 UART

8.1 I2C

I2C: U7
Topology: U7 » Targets (J11)
SignalNet NameConnectorTest PointTarget Pin
SCL (needs pull-up)I2C1_SCLJ11_2(none)U7_92 (PB6)
SDA (needs pull-up)I2C1_SDAJ11_3(none)U7_93 (PB7)
ControllerIndustry TypeDescription
U7STM32F765VITxSTMicroelectronics Arm Cortex-M7 MCU,
2048KB flash, 512KB RAM,
216 MHz, 1.7-3.6V, 82 GPIO,
LQFP100
I2C: U7 -> U5, U6, U8
Topology: U7 » Targets (U5, U6, U8, J10, J12, J2)
SignalNet NameConnectorTest PointTarget Pin
SCL (needs pull-up)I2C2_SCLJ10_2, J12_2, J2_4(none)U5_2 (SCL/SPC), U6_1 (SCL/SPC), U7_46 (PB10), U8_13 (SCL)
SDA (needs pull-up)I2C2_SDAJ10_3, J12_3, J2_5(none)U5_4 (SDA/SDI/SDO), U6_4 (SDA/SDI/SDO), U7_47 (PB11), U8_14 (SDA)
AddressTargetIndustry TypeDescription
0x5C (port I2C (SCL/SPC on I2C2_SCL), strap-set address, SDO/SA0=GND (low))U5LPS22HBTR
0x1E (port I2C (SCL/SPC on I2C2_SCL), fixed address)U6LIS2MDLTR
0x6A (port I2C (SCL on I2C2_SCL), strap-set address, SDO/SA0=GND (low))U8LSM6DSO
ControllerIndustry TypeDescription
U7STM32F765VITxSTMicroelectronics Arm Cortex-M7 MCU,
2048KB flash, 512KB RAM,
216 MHz, 1.7-3.6V, 82 GPIO,
LQFP100
I2C Pull-up Check
NetComponentStatus
I2C1_SDAPull-up not found on I2C1_SDA. This bus is mastered on-board by U7 and its addressable targets are off-board through J11; the interface standard for the attached device determines which side supplies the pull-up - confirm it is provided there.-
I2C1_SCLPull-up not found on I2C1_SCL. This bus is mastered on-board by U7 and its addressable targets are off-board through J11; the interface standard for the attached device determines which side supplies the pull-up - confirm it is provided there.-
I2C2_SDAPull-up on I2C2_SDA was not detected. A pull-up for basic I2C operation would be about 4.7K ohms. Even if an IC has internal pull-ups on its inputs, they are likely just for biasing the input high (47-100K ohms) and are not sufficient for I2C. We did not consult the datasheet for U5 but low-value resistors cost silicon area, so it is unlikely the IC has them.
I2C2_SCLPull-up on I2C2_SCL was not detected. A pull-up for basic I2C operation would be about 4.7K ohms. Even if an IC has internal pull-ups on its inputs, they are likely just for biasing the input high (47-100K ohms) and are not sufficient for I2C. We did not consult the datasheet for U5 but low-value resistors cost silicon area, so it is unlikely the IC has them.

8.2 SPI

SPI: U7, U9
Topology: U7, U9 » Targets ()
SignalNet NameConnectorTest Point
MOSIMOSI(none)(none)
MISOMISO(none)(none)
SCKSCK(none)(none)
CSCSN(none)(none)
ControllerIndustry TypeDescription
U7STM32F765VITxSTMicroelectronics Arm Cortex-M7 MCU,
2048KB flash, 512KB RAM,
216 MHz, 1.7-3.6V, 82 GPIO,
LQFP100
U9nRF24L01PnRF24L01+, Ultra low power 2.4GHz RF Transceiver,
QFN20 4x4mm

8.3 UART

UART [UART4]: U7
Topology: U7 » Targets (J3)
SignalNet NameConnectorTest Point
TXUART4_TXJ3_2(none)
RXUART4_RXJ3_3(none)
ControllerIndustry TypeDescription
U7STM32F765VITxSTMicroelectronics Arm Cortex-M7 MCU,
2048KB flash, 512KB RAM,
216 MHz, 1.7-3.6V, 82 GPIO,
LQFP100
UART [UART7]: U7
Topology: U7 » Targets (J2)
SignalNet NameConnectorTest Point
TXUART7_TXJ2_2(none)
RXUART7_RXJ2_3(none)
ControllerIndustry TypeDescription
U7STM32F765VITxSTMicroelectronics Arm Cortex-M7 MCU,
2048KB flash, 512KB RAM,
216 MHz, 1.7-3.6V, 82 GPIO,
LQFP100

8.4 LSSI DFT Analysis

4 signal(s) missing test point coverage. Test points allow ATE to run tests without requiring operator intervention and setup. They should be considered mandatory for high volume products.
During test, ATE can override functional operation to explicitly test through the interface in ways that functional operation cannot, or is not available at certain test stages.
Missing Test Points
SignalNet NameConnectorInterface
CSCSN(none)SPI: U7
MISOMISO(none)SPI: U7
MOSIMOSI(none)SPI: U7
SCKSCK(none)SPI: U7

9 High-Speed Serial Interfaces (HSSI)

1 single-ended controlled impedance signal(s)

9.1 Controlled Impedance Signals

Single-ended signals requiring controlled impedance. Grouped by target impedance value.

50 Ohm Signals
Net NameImpedance ClassNotes
AntennaRF_50Ohm

10 Memory Interface Analysis

Found 1 complete memory interface(s)

10.1 J13 SDMMC Connector

J13 (Micro_SD_Card) - SDMMC Connector Interface [4-bit]
SignalPin NamePin #Net NameTest PointSource IC
CARD_DETECTDET9SD_Detect-U7_62
CLOCKCLK5CLK-U7_80
CMDCMD3CMD-U7_83
DATA_0DAT07DAT0-U7_65
DATA_1DAT18DAT1-U7_66
DATA_2DAT21DAT2-U7_78
DATA_3DAT3/CD2DAT3-U7_79
Direct programming via test points is not needed since SD cards can be pre-programmed and inserted

10.2 AI-Assisted Analysis

This section is created by AI and should be reviewed for accuracy. There may be some incorrect analysis, especially if any errors are called out in the Design Summary or Component Value sections. STANDARD MODE — this analysis was produced by the standard model tier.

10.2.1 microSD Card Interface (J13) to STM32F765 (U7)

AI-Assisted — The only memory device is a microSD card in J13, a Hirose DM3AT-SF-PEJM5 socket. J13 has no datasheet entry, so every row that depends on the card or socket is at review severity at most.

The interface is a 4-bit point-to-point bus with no branches or stubs. J13 DAT0, DAT1, DAT2 and DAT3/CD reach U7 PC8, PC9, PC10 and PC11. J13 CMD reaches U7 PD2, and J13 CLK reaches U7 PC12. Each of the six lines passes through its own 22 Ω series resistor: R21, R23, R24, R26, R19 and R27.

The series resistors are justified by the host's edge rate. U7 GPIO outputs switch in 2.5 ns at the fastest output-speed setting into 10 pF, and in 4 ns into 30 pF (STMicroelectronics STM32F765VI datasheet p.161, Datasheet). These resistors damp ringing on the short card traces. Whether they work as source termination depends on placement near U7, which layout must preserve.

The card is powered from +3V3 (U2, 3.27 to 3.33 V). U7 I/O shares this rail once its VDD pins are joined to +3V3, as the power review requires. Because both sides run from one rail, no level translation is needed.

10.2.2 Pull-ups, Card Detect and Socket Power

AI-Assisted — R11, R13, R14, R9 and R10 are 10 kΩ resistors from CMD, DAT0, DAT1, DAT2 and DAT3 to +3V3. Each sits on the card side of its series resistor. CLK has no pull-up.

The high level holds with margin. At the 1 µA maximum U7 input leakage (p.157), each pull-up drops 10 mV, giving 3.26 V at the 3.27 V rail minimum. That is well above U7's VIH minimum of 0.7 × VDD, which is 2.29 V on the same rail.

The low level also holds. When U7 drives a line low it sinks 3.33 V / 10 kΩ = 0.33 mA. That is far below the 8 mA at which VOL is at most 0.4 V (p.159), so the line sits under the 0.98 V VIL maximum (0.3 × VDD, p.156). The extra drop across the 22 Ω resistor at this current is 7.3 mV.

R10 holds DAT3/CD high, so card presence is sensed mechanically on J13_9 DET rather than through DAT3. DET sits on SD_Detect with R15 10 kΩ to +3V3 and is read by U7 PD15. Its open-switch level is 3.26 V, inside U7's input limits. Whether DET closes to the shield on insertion or on removal is set by the socket, so the firmware polarity of PD15 depends on the DM3AT switch sense.

J13_4 VDD is wired directly to +3V3. J13_6 VSS and J13_10 SHIELD are both on GND.

10.3 Observations

AI-Assisted — Three robustness and testability points remain on the card side. None is a wiring error.

The socket is user-accessible, but none of the seven card nets (CMD, CLK, DAT0 to DAT3, SD_Detect) carries an ESD suppressor. Only the 22 Ω series resistors stand between a discharge into the card contacts and the U7 pins. A low-capacitance ESD array on the card side of the series resistors would clamp a discharge before it reaches U7. Its clamping voltage would have to sit below U7's I/O absolute maximum of min(VDD + 3.6 V, 5.5 V) (p.107).

J13 VDD is hard-wired to +3V3. The host therefore cannot power-cycle a card that has locked up. Recovery requires cycling the whole board, and hot insertion loads +3V3 directly. A load switch on J13 VDD, controlled by a spare U7 output, would give firmware a card power-cycle path. Adding it is a design decision for the designer.

The design summary states no test points on the board, and none of the seven card nets carries one. Bare-board and in-circuit access to the SD bus therefore depends on probing the socket contacts or the 22 Ω resistor pads.

The U7 power-pin wiring defect and the absence of J13 current from the +3V3 load budget are reported in the power review. They are not repeated here.

10.4 Findings

AI-Assisted —
#MemoryInterfaceFindingSeverity
10.4.1microSD (J13)Card detectThe DET switch sense (closed on insertion or on removal) is set by the DM3AT socket. Check the firmware polarity of PD15 against the socket's switch definition.Review
10.4.2microSD (J13)Card supplyJ13_4 VDD is on +3V3, 3.27 to 3.33 V (U2). Check that this is inside the card supply range.Review
10.4.3microSD (J13)Signal levelsU7 VOH is at least VDD − 0.4 V at −8 mA, which is 2.87 V at the 3.27 V rail minimum (STMicroelectronics STM32F765VI datasheet p.159). Check that the card's VIH on CMD, CLK and DAT0 to DAT3 is compatible.Review
10.4.4microSD (J13)Signal levelsU7 VIH minimum is 0.7 × VDD, which is 2.33 V at the 3.33 V rail maximum (STMicroelectronics STM32F765VI datasheet p.157). Check that the card's VOH on CMD and DAT0 to DAT3 is compatible.Review
10.4.5microSD (J13)ESDNone of the seven card nets carries an ESD suppressor at the user-accessible socket. A low-capacitance ESD array on the card side of the 22 Ω resistors, clamping below U7's I/O absolute maximum of min(VDD + 3.6 V, 5.5 V) (STMicroelectronics STM32F765VI datasheet p.107), would protect U7.Review
10.4.6microSD (J13)Card supplyJ13 VDD is hard-wired to +3V3, so firmware cannot power-cycle a locked card and insertion loads +3V3 directly. A U7-controlled load switch on J13 VDD would add a recovery path.Review
10.4.7microSD (J13)TestabilityNone of the seven card nets carries a test point; the design states no test points board-wide. Bus access for test depends on the socket contacts or the series resistor pads.Review
10.4.8microSD (J13)SDMMC CLKCLK has R27 22 Ω in series and no pull-up. The card clock is driven push-pull by U7 PC12 at all times.Info
10.4.9microSD (J13)Card detectR10 10 kΩ holds DAT3/CD high, so presence is sensed on the mechanical J13_9 DET switch rather than through DAT3. Using DAT3 sensing instead would need DAT3 left without a strong pull-up.Info
10.4.10microSD (J13)SDMMC 4-bitJ13 DAT0, DAT1, DAT2, DAT3/CD, CMD and CLK each reach a separate U7 pin (PC8, PC9, PC10, PC11, PD2, PC12) on a point-to-point 4-bit bus with no stubs or shared nets.✓
10.4.11microSD (J13)SDMMC 4-bitAll six bus lines carry 22 Ω series resistors (R21, R23, R24, R26, R19, R27). These damp U7 edges of 2.5 ns into 10 pF at the highest speed setting (STMicroelectronics STM32F765VI datasheet p.161). Placement near U7 is a layout requirement.✓
10.4.12microSD (J13)SDMMC pull-upsR11, R13, R14, R9 and R10 are 10 kΩ from CMD and DAT0 to DAT3 to +3V3. At the 1 µA maximum U7 leakage the high level is 3.26 V, above the 2.29 V VIH minimum (0.7 × 3.27 V) (STMicroelectronics STM32F765VI datasheet p.157).✓
10.4.13microSD (J13)SDMMC pull-upsThe 10 kΩ pull-ups load a U7 low output with 0.33 mA, far below the 8 mA at which VOL is at most 0.4 V. That is under the 0.98 V VIL maximum (STMicroelectronics STM32F765VI datasheet p.156, p.159).✓
10.4.14microSD (J13)Card detectJ13_9 DET is on SD_Detect with R15 10 kΩ from SD_Detect to +3V3, read by U7 PD15. The open-switch level is 3.26 V, above the 2.29 V VIH minimum (STMicroelectronics STM32F765VI datasheet p.157).✓
10.4.15microSD (J13)Socket groundJ13_6 VSS and J13_10 SHIELD are both on GND.✓

10.5 Citations

AI-Assisted —
References
STM32F765VI (STMicroelectronics) — datasheet
www.st.com/resource/en/datasheet/stm32f765vi.pdf

11 Functional Analysis

8 device(s) to review across 3 category(ies)

Device Inventory
RefDesCategoryPart NumberDescriptionInterfacesHSSI
Y1CRYSTAL25MHzFour pin crystal, GND on pins 2 and 3, small symbol--
Y2CRYSTAL16MHzFour pin crystal, GND on pins 2 and 3, small symbol--
U3DEVICEUS1881High Sensitivity Micropower Omnipolar Hall-Effect Switch, SIP-3--
U5DEVICELPS22HBTRI2C-
U6DEVICELIS2MDLTRI2C-
U7DEVICESTM32F765VITxSTMicroelectronics Arm Cortex-M7 MCU, 2048KB flash, 512KB RAM, 216 MHz, 1.7-3.6V, 82 GPIO, LQFP100I2C, SPI, UART [UART4], UART [UART7]-
U8DEVICELSM6DSOI2C-
U9WIRELESSnRF24L01PnRF24L01+, Ultra low power 2.4GHz RF Transceiver, QFN20 4x4mmSPI-

11.1 Reset-Time Strap Configuration

Each device below takes part of its start-up configuration from resistors the board fits on pins it samples at reset. Every setting is resolved against that device's own datasheet tables - the combination this board selects, and whether the datasheet marks that combination reserved or invalid.

RefDesConfigurationThis Board SelectsRead FromStatus
U9nRF24L01PNo reset-time straps: probe: the pages show no reset-time configuration✓
RefDesPinRead FromSets
U7BOOT0 (U7_94)open (on no net - unconnected)boot memory space - the datasheet tabulates no modes for this pin
U7PDR_ONnot a pin of this symbol
U7BYPASS_REGnot a pin of this symbol

11.2 Functional Analysis

This section is created by AI and should be reviewed for accuracy. There may be some incorrect analysis, especially if any errors are called out in the Design Summary or Component Value sections. STANDARD MODE — this analysis was produced by the standard model tier.

11.2.1 STM32F765VITx Microcontroller (U7) and 25 MHz HSE Crystal (Y1)

AI-Assisted — U7 runs from +3V3, which U2 holds at 3.27 to 3.33 V. That is inside the 1.7 to 3.6 V VDD range in the STMicroelectronics datasheet (Datasheet, p.109). The wiring of the VDD, VDDA, VBAT and VREF+ pins and of the VCAP capacitors is covered in the power review and is not repeated here.

NRST has R8 (10 kΩ) to +3V3 and C20 (100 nF) to GND, in addition to its permanent internal pull-up (p.162).

The programming path is the main problem. SWDIO, SWCLK and SWO each end at the far pad of R16, R17 or R18 (22 Ω), so U7 PA13, PA14 and PB3 reach no connector. NRST appears on no connector either. U7_94 BOOT0 is unconnected in the schematic and has no pull to either level, so the boot memory space it selects at reset (p.73) is undefined. Together these leave no defined way to load firmware into U7.

On the serial ports, J5 carries the nets TX1 and RX1, while U7 PB14 and PB15 carry USART1_TX and USART1_RX. The names differ, so the J5 port is not joined to U7.

The HSE oscillator uses Y1 at 25 MHz, inside the 4 to 26 MHz HSE band the datasheet characterises (p.114). C24 (18 pF) and C28 (18 pF) each go from one Y1 pin to ground. Seen across the crystal through ground they give CL = 18 × 18 / (18 + 18) = 9 pF, plus pin and board stray.

R12 (47 kΩ) sits in series between PH1-OSC_OUT and Y1. The datasheet allows an optional, resonator-dependent drive resistor at this position (p.137). However, 47 kΩ against C28 forms a low-pass with a corner of 1/(2π × 47 kΩ × 18 pF) = 188 kHz. At 25 MHz the reactance of C28 is 354 Ω, so the drive reaching the crystal is attenuated by about 133 times (42 dB). That attenuation is taken directly out of the oscillator loop gain.

11.2.2 nRF24L01+ Transceiver (U9) and 16 MHz Crystal (Y2)

AI-Assisted — U9 VDD (U9_7, U9_15, U9_18) is on +3V3 at 3.27 to 3.33 V. That is inside the 1.9 to 3.6 V operating range and below the 3.6 V absolute maximum in the Nordic datasheet (Datasheet, pp.18-19). Supply, DVDD and VDD_PA decoupling are covered in the power review.

IREF has R20 (22 kΩ) to GND, as pages 11 and 66-67 require.

The RF output follows the single-ended 50 Ω reference network on pages 64 and 66-67:
- L4 (8.2 nH) bridges ANT1 and ANT2.
- L3 (2.7 nH) feeds ANT1 from VDD_PA, giving both antenna pins their DC path.
- L5 (3.9 nH) and C38 (1.5 pF) run in series from ANT2 to the Antenna net.
- C37 (1 pF) shunts the Antenna net to ground at J14, whose shell is on GND.

Y2 is 16 MHz, matching the required crystal frequency (p.25). C39 and C46 (22 pF each) go from XC1 and XC2 to ground. Across the crystal through ground they give 22 × 22 / (22 + 22) = 11 pF plus stray, which suits the 12 pF crystal of the reference design inside the 8 to 16 pF window. R22 (1 MΩ) is fitted across XC1 and XC2. Page 67 marks that resistor as not mounted for the nRF24L01+ and keeps it only for nRF24L01 compatibility.

The SPI and control lines run point to point to U7: CSN to PA3, SCK to PA5, MOSI to PA7, MISO to PA6, CE to PA4, and the active-low IRQ to PA2. Both parts share +3V3, and the logic levels have margin in both directions:
- U7 VOH is at least VDD − 0.4 V (2.87 V at a 3.27 V rail), against the nRF24L01+ VIH of 0.7 × VDD.
- The nRF24L01+ VOH is at least VDD − 0.3 V (2.97 V), against the U7 VIH of 2.33 V.

CSN has no external pull-up, and the datasheet states no internal pull on it. Whether CSN stays deselected before firmware runs therefore depends on the reset state of U7 PA3.

11.2.3 Barometer, Magnetometer and IMU on I2C2 (U5, U6, U8)

AI-Assisted — All three sensors take VDD and VDD_IO from +3V3 at 3.27 to 3.33 V, inside each part's supply range:
- LPS22HB: 1.7 to 3.6 V.
- LIS2MDL: 1.71 to 3.6 V.
- LSM6DSO: VDD 1.71 to 3.6 V and VDDIO 1.62 to 3.6 V.

The datasheets are from STMicroelectronics (source: Tomachie). The 100 nF ceramic decoupling each part asks for is present on +3V3, as are the 4.7 µF optional for the LPS22HB and the 10 µF the LIS2MDL names.

Each part has its CS pin tied to +3V3, which the states tables define as I²C enabled.
- U5: RES goes to GND as required, and SDO/SA0 to GND selects address 0x5C (LPS22HB p.24).
- U6: the three NC pins are internally unconnected and are left open, which the datasheet permits.
- U8: SDx and SCx are tied to GND, which is the Mode 1 connection. OCS_Aux and SDO_Aux are left open as Mode 1 allows, and SDO/SA0 is on GND.

The bus itself is the problem. I2C2_SCL and I2C2_SDA join U7 PB10 and PB11 to U5, U6 and U8 and leave the board on J2, J10 and J12. Neither net carries a pull-up resistor, although the page has an "I2C Pull-Up" block note. The LIS2MDL datasheet requires an external pull-up to Vdd_IO (p.15), and the LSM6DSO datasheet specifies 10 kΩ (p.35). U7's internal pull-ups are 30 to 50 kΩ (STMicroelectronics STM32F765VI datasheet p.157), three to five times weaker than that figure.

The interrupt outputs reach no other pin. BAR_INT (U5_7), MAG_INT (U6_7) and IMU_INT (U8_4) each connect only to their own sensor, so firmware must poll all three sensors.

11.2.4 US1881 Hall-Effect Switch (U3)

AI-Assisted — U3 is the magnetic power switch. Its supply is +BATT, and its open-drain output drives Net-(DZ1-A), the gate of Q1. R3 (10 kΩ) pulls that net to +BATT, which matches the Melexis application circuit (Datasheet, p.10). The battery-voltage ratings, the DZ1 clamp current and the decoupling of U3 are covered in the power review.

The library description calls U3 an omnipolar switch, but the datasheet describes latch behaviour. In the UA (SIP-3, TO-92 footprint) package the output goes low when the field exceeds BOP (0.5 to 9.5 mT, south pole at the branded face), which turns Q1 on. It goes high only when the field falls below BRP (−9.5 to −0.5 mT, north pole). The output keeps its state when the magnet is removed (pp.6-7). The operating magnet therefore has to present one pole to switch the board on and the opposite pole to switch it off.

The part number carries no temperature suffix. Even the narrowest grade, E (−40 to 85 °C), covers the 40 °C design ambient.

11.3 Findings

AI-Assisted —
#DeviceFindingSeverity
11.3.1STM32F765VITx (U7)SWDIO, SWCLK and SWO end at R16, R17 and R18 (22 Ω) with no other member, so U7 PA13, PA14 and PB3 reach no connector or test point. NRST is on no connector either. U7 cannot be programmed or debugged over SWD as drawn. Route SWDIO, SWCLK, SWO, NRST, +3V3 and GND to a debug connector.High
11.3.2U5, U6, U8 (I2C2)I2C2_SCL and I2C2_SDA join U7 PB10/PB11, U5, U6 and U8 and leave on J2, J10 and J12, with no pull-up resistor on either net. The LIS2MDL datasheet (p.15) requires an external pull-up to Vdd_IO, and the LSM6DSO datasheet (p.35) specifies 10 kΩ. Add 10 kΩ from each net to +3V3.High
11.3.3STM32F765VITx (U7)U7_94 BOOT0 is unconnected in the schematic and has no resistor to either level. BOOT0 selects the boot memory space at reset (STMicroelectronics datasheet p.73), so the boot source is undefined. Tie BOOT0 through a resistor to the level that selects the memory the firmware is built for, and bring it to a test point or the debug connector.Medium
11.3.4STM32F765VITx (U7), J5J5_2 (net TX1) and J5_3 (net RX1) reach no other pin. U7 PB14 (USART1_TX) and PB15 (USART1_RX) also reach nothing. Because the net names differ, the J5 receiver port is not connected to U7. Rename the J5 nets to the U7 UART nets the firmware uses.Medium
11.3.5R12, Y1 (U7 HSE)R12 (47 kΩ) in series from PH1-OSC_OUT to Y1 forms a 188 kHz low-pass with C28 (18 pF). At 25 MHz it attenuates the drive into C28's 354 Ω reactance by about 133 times (42 dB), removing that much oscillator loop gain. The datasheet calls this drive resistor optional and resonator-dependent (p.137). Replace R12 with a 0 Ω link, or with a value at or below C28's 354 Ω reactance chosen against Y1's drive-level rating.Medium
11.3.6LPS22HBTR (U5)U5_7 INT_DRDY is on BAR_INT, which reaches no U7 pin, so firmware must poll the sensor. Route BAR_INT to a spare U7 GPIO.Low
11.3.7LIS2MDLTR (U6)U6_7 INT/DRDY is on MAG_INT, which reaches no U7 pin, so firmware must poll the sensor. Route MAG_INT to a spare U7 GPIO.Low
11.3.8LSM6DSO (U8)U8_4 INT1 is on IMU_INT, which reaches no U7 pin, so firmware must poll the sensor. Route IMU_INT to a spare U7 GPIO.Low
11.3.9STM32F765VITx (U7)UART5_TX/RX (PB13/PB12), USART3_TX/RX (PD8/PD9) and UART8_TX/RX (PE1/PE0) are labelled nets carrying only the U7 pin. No connector or device reaches them.Review
11.3.10STM32F765VITx (U7), J11I2C1_SCL (PB6) and I2C1_SDA (PB7) reach only J11 pins 2 and 3 and have no pull-up. The pull-ups must come from the assembly mating with J11, or from U7's 30 to 50 kΩ internal pull-ups (STMicroelectronics datasheet p.157).Review
11.3.11Y1, C24, C28 (U7 HSE)C24 and C28 (18 pF each, pin to ground) give CL = 18 × 18 / (18 + 18) = 9 pF across Y1 through ground, plus pin and board stray. Check this against Y1's specified load capacitance.Review
11.3.12Y2, C39, C46 (U9)Y2 is 16 MHz, as required. C39 and C46 (22 pF each, pin to ground) give 11 pF across the crystal through ground plus stray, consistent with the 12 pF crystal of the reference design and inside the 8 to 16 pF window (Nordic datasheet pp.25, 66-67). Check this against Y2's specified load capacitance.Review
11.3.13R22 (U9)R22 (1 MΩ) is fitted across XC1 and XC2. The Nordic datasheet (p.67) marks this resistor as not mounted for the nRF24L01+ and optional only for nRF24L01 backward compatibility.Review
11.3.14nRF24L01P (U9)CSN has no external pull-up, and the nRF24L01+ datasheet states no internal pull on CSN. Check that U7 PA3's reset state holds CSN deselected until firmware configures it.Review
11.3.15LIS2MDLTR (U6)100 nF and 10 µF are on +3V3. The STMicroelectronics datasheet (p.13) names a 10 µF aluminium capacitor near U6_9 VDD, while the board's 10 µF parts (C30, C44) are ceramic.Review
11.3.16US1881 (U3)The library description calls U3 an omnipolar switch, but the Melexis datasheet describes a latch. The UA output goes low (Q1 on) when the field exceeds BOP of 0.5 to 9.5 mT (south pole), and goes high only when it falls below BRP of −9.5 to −0.5 mT (north pole). The state is held with the field removed (pp.6-7). The magnet must present opposite poles to switch the board on and off.Review
11.3.17STM32F765VITx (U7), Y1Y1 at 25 MHz is inside the 4 to 26 MHz HSE band characterised in the STMicroelectronics datasheet (p.114).✓
11.3.18STM32F765VITx (U7)NRST has R8 (10 kΩ) to +3V3 and C20 (100 nF) to GND, in addition to the permanent internal pull-up (STMicroelectronics datasheet p.162).✓
11.3.19STM32F765VITx (U7)U7_8 PC14-OSC32_IN and U7_9 PC15-OSC32_OUT are unconnected in the schematic. The LSE is unused, so the 32.768 kHz crystal and load capacitors of datasheet pp.137-138 are not needed.✓
11.3.20STM32F765VITx (U7)Temperature grade 6 is rated −40 to 85 °C ambient at full power dissipation, which covers the 40 °C design ambient (STMicroelectronics datasheet p.110).✓
11.3.21nRF24L01P (U9)VDD on +3V3 (3.27 to 3.33 V) is inside the 1.9 to 3.6 V operating range and below the 3.6 V absolute maximum (Nordic datasheet pp.18-19).✓
11.3.22nRF24L01P (U9), R20U9_16 IREF has R20 (22 kΩ) to GND, as required (Nordic datasheet pp.11, 66-67).✓
11.3.23nRF24L01P (U9), L3, L4, L5, C37, C38, J14The matching network matches the 50 Ω reference on pp.64 and 66-67. L4 (8.2 nH) bridges ANT1 and ANT2, and L3 (2.7 nH) gives the DC path to VDD_PA. L5 (3.9 nH) and C38 (1.5 pF) run in series to the Antenna net, and C37 (1 pF) shunts it at J14.✓
11.3.24nRF24L01P (U9), U7CSN, SCK, MOSI, MISO, CE and IRQ run point to point to U7 PA3, PA5, PA7, PA6, PA4 and PA2. Both parts are on +3V3. U7 VOH of at least 2.87 V and the nRF24L01+ VOH of at least 2.97 V each exceed the other part's VIH of 0.7 × VDD (2.33 V at 3.33 V). Both VOL figures (0.4 V and 0.3 V) are below the 0.98 V VIL.✓
11.3.25LPS22HBTR (U5)VDD and VDD_IO are on +3V3 (1.7 to 3.6 V range), and 100 nF plus 4.7 µF are on the rail. CS is tied to +3V3, which selects I²C, and RES is tied to GND as required. SDO/SA0 on GND selects address 0x5C (STMicroelectronics datasheet p.24).✓
11.3.26LIS2MDLTR (U6)VDD and VDD_IO are on +3V3 (1.71 to 3.6 V range), and CS is tied to +3V3, which enables I²C. U6_2, U6_11 and U6_12 are NC pins, internally unconnected, and are left open, which the datasheet permits.✓
11.3.27LSM6DSO (U8)VDD and VDDIO are on +3V3 within 1.71 to 3.6 V and 1.62 to 3.6 V, with 100 nF on the rail (p.35). CS is tied to +3V3, which selects I²C. SDx and SCx are tied to GND, the Mode 1 connection. OCS_Aux and SDO_Aux are left open, as Mode 1 permits. SDO/SA0 is on GND.✓
11.3.28US1881 (U3)Even the narrowest temperature grade, E (−40 to 85 °C), covers the 40 °C design ambient (Melexis datasheet p.6).✓

11.4 Citations

AI-Assisted —
References
AON6262E (Alpha & Omega Semiconductor (AOS)) — datasheet
www.aosmd.com/sites/default/files/res/datasheets/AON6262E...
AP63203 (Diodes Incorporated) — datasheet
www.mouser.com/datasheet/2/115/AP63200_AP63201_AP63203_AP...
MMSZ5245 (onsemi) — datasheet
www.mouser.com/datasheet/2/308/MMSZ5221ET1_D-1773609.pdf
SK6812 (LED COLOR (www.szledcolor.com)) — datasheet
cdn-shop.adafruit.com/product-files/1138/SK6812+LED+datas...
SMBJ (Kyocera AVX) — datasheet, cited pages 1,2,3
datasheets.kyocera-avx.com/tvsdiodes.pdf
STM32F765VI (STMicroelectronics) — datasheet
www.st.com/resource/en/datasheet/stm32f765vi.pdf
US1881 (Melexis) — datasheet
www.mouser.com/datasheet/2/734/US1881_Datasheet_Melexis-2...
nRF24L01P (Nordic Semiconductor ASA) — datasheet
datasheet.lcsc.com/datasheet/pdf/1f70bc6ad7df407cb308db24...

12 Designer Annotated Nets

Annotated signals4

Designer-placed annotation markers on nets that are not already analyzed as HSSI differential pairs or Memory Bus signals.

Designer Annotations
Net NameAnnotationImpedanceNotes
VCCPWR_HIGH
+3V3PWR_LOW
+5VPWR_LOW
GNDPWR_LOW

13 EMC & ESD Protection Checks

Checks run1
Passed0
Issues found1
EMC Check Summary
CheckIssuesStatus
Connector Shell Grounding1

13.1 Connector Shell Grounding

RefDesTypeIssueRecommendationSeverity
J13Micro_SD_CardJ13: Shield pins SHIELD share the logic GND net, so the shield-bond strategy is not captured as design intent.Assign a dedicated schematic net per connector (e.g. SHIELD_GND_TYPE_C, SHIELD_GND_SD) so the pour and bond parts are explicit. A copper pour under the connector and stitched directly to logic GND is an acceptable simplification for a board that has no access to an earth ground and will not be ESD-tested. For professional designs, with or without earth ground access, use a 1 MΩ || 4.7 nF (≥2 kV) from the shield net to logic GND. IEC 61000-4-2.

13.2 ESD/TVS Protection Audit

Audit of connector-facing signal nets for ESD/TVS protection presence and orientation correctness.

Connector-facing signal nets analyzed: 7 connector-facing signal(s). 0 protected, 7 unprotected, 0 to review, 0 orientation issue(s).

13.2.1 Unprotected Signal Nets

Signal NetConnectorStatus
DAT2J13No ESD Protection
DAT3J13No ESD Protection
DAT1J13No ESD Protection
CMDJ13No ESD Protection
DAT0J13No ESD Protection
SD_DetectJ13No ESD Protection
CLKJ13No ESD Protection

13.3 EMC & ESD Analysis

This section is created by AI and should be reviewed for accuracy. There may be some incorrect analysis, especially if any errors are called out in the Design Summary or Component Value sections. STANDARD MODE — this analysis was produced by the standard model tier.

13.3.1 EMC Architecture

AI-Assisted — The caiman board has one ground domain, GND, a digital return. There is no chassis or earth net and no part connected between grounds, so every connector return and the J13 card-socket shield sit on logic GND. That suits a battery-powered vehicle controller with no earth reference. The designer's notes on the sheet name its functions: battery connector, ESC power and PWM, RC receiver, RF communication, SD card and spare I2C/leak detection. Only J13 has a shell terminal. The J14 outer conductor (J14_2 Ext) is the RF return on GND. The symbols of J1, J2, J3, J4, J7, J10, J11 and J12 carry no shell pin. Filtering exists on two interfaces only: the six microSD lines through 22 Ω series resistors, and the RF port through the Nordic reference network. None of the signal nets on J1, J2, J3, J4, J10, J11 or J12 carries a series resistor, ferrite, capacitor or clamp; each runs straight to U7, U5, U6 or U8 pins. Emissions are judged against CISPR 32 / EN 55032 Class B, and the 2.4 GHz radio against ETSI EN 301 489-1/-17 and EN 300 328 (FCC Part 15). Immunity is judged against EN 55035, whose IEC 61000-4-2 test applies 4 kV contact and 8 kV air at user-accessible points. The likely field failures are ESD coupling into unbuffered MCU and sensor pins, and radiated emission from unshielded harnesses carrying fast edges and ESC return current.

13.3.2 Power Entry: J7, J8 and J9

AI-Assisted — J7 is an XT30 vertical power connector. J7_2 sits on Net-(D1-A), which also holds D1 SMBJ33CA (D1_1 on GND), C9 0.1 µF, U4_6 ANODE, U4_3 EN, the Q2 source pins and R6 100 kΩ to VCHG. D1 is the clamp on that contact, and nothing stands in series between J7_2 and D1. D1 therefore takes the surge first and is the last clamp before U4 ANODE and Q2. The power review already covers D1's clamping level against Q2 and U4 and its unidirectional pin names. U7_16 PC1 sees J7 only through R6 100 kΩ, which limits pin current to about 0.33 mA at 33 V.

On J8, +BATT has DZ1 as its only diode. DZ1's anode is on Net-(DZ1-A), so it acts as Q1's gate clamp rather than a shunt to GND. A positive surge on +BATT raises the Q2 drain above its source. That reverse-biases the body diode, and U4 holds the gate off, so D1 never sees a J8 transient. The battery voltage is not stated, so any +BATT clamp standoff must be chosen against it.

On J9, VCC feeds U1's switching input with only C3 and C11 as filtering. U1's input ripple current therefore returns along the ESC harness, which then acts as a radiating loop.

13.3.3 ESC PWM Headers: J1 and J4

AI-Assisted — J1 and J4 are vertical 2.54 mm 1x03 headers. Pin 3 carries THRR or THRL straight to U7_59 PD12 or U7_60 PD13, pin 1 is GND and pin 2 is unconnected. The headers sit on an ESC harness that also routes motor switching current, and the far end is the ESC, so these are cabled ports. U7 drives the cable unterminated. At OSPEEDR = 11 the edge is 2.5 ns maximum into 10 pF (STMicroelectronics STM32F765VI datasheet p.161, Datasheet). Such edges put harmonics well into the CISPR 32 radiated band, while ESC PWM rates need nothing faster than the OSPEEDR = 00 setting, which gives 100 ns maximum into 50 pF (p.160). A discharge to the harness reaches the MCU pin with no series impedance. A series resistor at each header pin, together with the slow speed setting, would slow the edge into the cable and limit current into U7's internal clamp during an IEC 61000-4-2 event. The ESC supply returns through J9_1 GND, while the PWM references J1_1 and J4_1. Motor current sharing those paths shifts the reference the ESC input sees, which shows up as ground bounce and false pulses.

13.3.4 JST GH Peripheral Connectors: J2, J3, J10, J11, J12

AI-Assisted — These are 1.25 mm JST GH vertical connectors for off-board sensors, the RC receiver and spare buses. They are wire-to-board ports whose exposure depends on whether each harness leaves the enclosure. I2C2 leaves the board on three of them, J2, J10 and J12. A strike on any one of them reaches all four bus members at once: U7_46/U7_47, U5_2/U5_4, U6_1/U6_4 and U8_13/U8_14. The three sensors are each rated 2 kV HBM (STMicroelectronics LPS22HB datasheet p.14, LIS2MDL datasheet p.11, LSM6DSO datasheet p.15, source: Tomachie). HBM is a component-handling test, however, and its waveform and source impedance differ from IEC 61000-4-2, so no system margin follows from it. The sensor control-pin absolute maximum is Vdd_IO + 0.3 V, which is 3.63 V at the 3.33 V rail maximum. I2C1 on J11, UART7 on J2 and UART4 on J3 reach U7 pins with no series element either. J10, J11 and J12 export +3V3, and J2 and J3 export +5V, with no series element. A harness short on +5V also takes down +3V3, because U2 is fed from +5V. The bulk capacitance on +3V3 does absorb ESD charge arriving on those supply pins.

13.3.5 microSD Socket: J13

AI-Assisted — J13_10 SHIELD and J13_6 VSS are both on GND. A microSD socket takes no cable from a second device at a different static potential. A direct, low-inductance shield bond to logic GND is therefore acceptable here, and the dedicated-shield-net and R||C bond guidance for cabled connectors does not apply. The memory-bus review has already reported the absence of an ESD suppressor on the seven card nets, together with the 22 Ω series resistors R19, R21, R23, R24, R26 and R27. Those resistors sit between the card contacts and U7, add a little series impedance to a discharge at the card, and slow the U7 edges that would otherwise radiate from the socket.

13.3.6 RF Port: J14

AI-Assisted — J14 is a vertical U.FL connector feeding a 50 Ω antenna lead. The Antenna net holds C37 1 pF to GND and C38 1.5 pF in series to L5 3.9 nH, L4 8.2 nH across ANT1 and ANT2, and L3 2.7 nH to U9_11 VDD_PA. This is the network shown in the Nordic nRF24L01+ reference (datasheet pp.64, 66-67, Datasheet). C38 blocks DC but passes the fast edge of a discharge into U9_12 ANT1 and U9_13 ANT2. The port carries no clamp. Whether that matters depends on whether the antenna or its lead is reachable from outside the enclosure. Apart from the reference matching network, no harmonic filter is fitted between C38 and J14. Conducted spurious and harmonic emissions are therefore set by U9 and that network, and are judged at product level against EN 300 328 and FCC Part 15.247.

13.4 Observations

AI-Assisted — Across all the connectors, the only transient clamp fitted is D1 on J7, and the only signal filtering is the SD series resistors and the RF network. That is common on hobby-level vehicle boards whose harnesses stay inside a sealed hull. For a consumer product that must pass EN 55035, each externally reachable port needs a defined path for discharge current: a series resistor plus a low-capacitance array to GND on signal pins, and a TVS on power pins. Without that path, the current flows into U7, U5, U6 and U8 pins. In a non-conductive enclosure with no chassis, the charge lands on the board either way; the protection changes where it enters and the waveform, not the destination. The largest radiated-emission risks are the fast unterminated PWM edges on J1 and J4, the ESC and battery leads carrying U1's input ripple, and the 2.4 GHz harmonics at J14. The single GND domain needs no change. Only connector shields would ever come off the plane, and the one shield here, J13, is correctly bonded directly.

13.5 Findings

AI-Assisted —
#ConnectorFindingSeverity
13.5.1J14The Antenna net carries C37 1 pF to GND and C38 1.5 pF in series to L5, L4 and L3, with no ESD clamp. A discharge to the antenna couples through C38 into U9_12 ANT1 and U9_13 ANT2. Where the antenna or its lead is user-accessible, an ESD device specified for 2.4 GHz insertion loss at J14 would keep the strike off U9. IEC 61000-4-2; ETSI EN 301 489-17.Review
13.5.2J14Apart from the Nordic reference matching network (datasheet pp.64, 66-67), no harmonic filter is fitted between C38 and J14. Harmonic and spurious emissions are judged at product level against EN 300 328 and FCC Part 15.247.Review
13.5.3J7Net-(D1-A) carries no fuse between J7_2 and D1, so a sustained over-voltage from the charger above D1's breakdown holds D1 in conduction with nothing in its path to open. A fuse or PTC on the J7 side of D1, rated for the charge current, would give D1 a series element that opens.Review
13.5.4J8The only diode on +BATT is DZ1, wired from +BATT to Net-(DZ1-A) as Q1's gate clamp rather than to GND, so a transient entering on J8 is absorbed only by C11 47 µF. Q2 does not pass it to D1, because a drain-high surge reverse-biases the body diode and U4 holds the gate off. A TVS at J8 with standoff above the battery voltage and clamping below Q2's 60 V VDS (AOS AON6262E datasheet p.1, Datasheet) would cover this entry. The battery voltage is not stated, so the standoff must be chosen against it.Review
13.5.5J9VCC from the ESC lead feeds U1's switching input with only C3 and C11 as filtering, so U1's input ripple current returns along the J9 harness and radiates from it. An LC or ferrite filter between J9 and C3 would keep that current on the board. CISPR 32 radiated emissions.Review
13.5.6J1, J4THRR and THRL run from J1_3 and J4_3 directly to U7_59 PD12 and U7_60 PD13, with no series resistor or clamp. The edge is 2.5 ns into 10 pF at OSPEEDR = 11 (STMicroelectronics STM32F765VI datasheet p.161, Datasheet). The ESC harness radiates its harmonics, and a strike reaches the pin unattenuated. OSPEEDR = 00 in firmware (100 ns maximum into 50 pF, p.160) plus a series resistor at each header pin would slow the edge and limit current into U7's clamp. CISPR 32; IEC 61000-4-2.Review
13.5.7J1, J4, J9The ESC supply returns via J9_1 GND, while THRR and THRL reference J1_1 and J4_1 GND. Motor current shared between these returns shifts the PWM reference at the ESC (ground bounce). Bring the header GND returns to the same point as J9_1, and run each PWM wire paired with its GND.Review
13.5.8J2, J10, J12I2C2_SCL and I2C2_SDA leave the board on three connectors and reach U5, U6, U8 and U7_46/U7_47 with no series resistor or clamp. U5, U6 and U8 are 2 kV HBM parts (STMicroelectronics LPS22HB p.14, LIS2MDL p.11, LSM6DSO p.15, source: Tomachie). HBM and IEC 61000-4-2 use different waveforms and source impedances, so no system margin can be stated. A low-capacitance TVS array to GND plus series resistors at the connectors would keep strikes off all four devices.Review
13.5.9J11I2C1_SCL and I2C1_SDA run from J11_2 and J11_3 directly to U7_92 PB6 and U7_93 PB7, with no series resistor or clamp. Where the J11 harness is externally reachable, a series resistor and low-capacitance TVS array to GND would limit discharge current into U7. IEC 61000-4-2.Review
13.5.10J2, J3UART7 (J2_2/J2_3 to U7_38 PE8/U7_37 PE7) and UART4 (J3_2/J3_3 to U7_71 PA12/U7_70 PA11) connect directly, with no series resistor or clamp. A series resistor at each pin would limit discharge and contention current into U7, with a TVS array to GND where the harness leaves the enclosure. IEC 61000-4-2.Review
13.5.11J10, J11, J12+3V3 is exported on pin 1 of each connector with no series element. A harness short or strike lands directly on the rail shared by U5, U6, U8, U9 and U7. A resettable fuse or current limiter in series with the off-board +3V3 pins would isolate harness faults from the MCU rail.Review
13.5.12J2, J3+5V is exported on pin 1 of J2 and J3 with no series element. A harness short collapses +5V and, through U2, +3V3. A resettable fuse or current limiter in series with each off-board +5V pin would isolate harness faults from both rails.Review
13.5.13J2J2 carries the value Conn_01x04_Pin on a six-pin JST GH BM06B-GHS-TBT footprint with a six-pin symbol; the label disagrees with the part. This belongs to the functional/BOM review.Review
13.5.14All connectorsSingle ground domain GND. There is no chassis net and no part between grounds; every connector return and the J13 shield sit on logic GND, consistent with a battery-powered product with no earth reference. CISPR 32; EN 55035.Info
13.5.15J1, J4Pin 2 of both headers is unconnected, so an ESC with a BEC cannot back-feed its supply onto the board; only PWM and GND are exchanged. Wiring pin 2 to a rail would let the ESC supply drive that rail.Info
13.5.16J13J13_10 SHIELD is on GND directly. A microSD socket takes no cable from a second device at another potential, so a direct low-inductance shield bond to logic GND is acceptable and no dedicated shield net or R||C bond is needed. IEC 61000-4-2.✓
13.5.17J14J14_2 Ext (U.FL outer conductor) is on GND, the correct RF return for the 50 Ω feed into U9's matching network (Nordic nRF24L01+ datasheet pp.64, 66-67, Datasheet).✓
13.5.18J7J7_2 on Net-(D1-A) has D1 SMBJ33CA to GND with no series element ahead of it, so D1 is the first and last clamp before U4_6 ANODE and the Q2 source. This is the placement TI shows for the optional SMBJ33CA in the LM74700 12-V reference (TI LM74700 datasheet Fig. 10-2, p.14, source: Tomachie). IEC 61000-4-2; IEC 61000-4-5.✓
13.5.19D2, D3, D4SK6812 pin 1 VSS is on GND and pin 3 VDD on +5V, matching the datasheet pin functions. The device is rated 4000 V ESD and has built-in reverse-polarity protection (SK6812 datasheet p.3, Datasheet). The LEDs sit on no connector.✓

13.6 Citations

AI-Assisted —
References
AON6262E (Alpha & Omega Semiconductor (AOS)) — datasheet
www.aosmd.com/sites/default/files/res/datasheets/AON6262E...
MMSZ5245 (onsemi) — datasheet
www.mouser.com/datasheet/2/308/MMSZ5221ET1_D-1773609.pdf
SK6812 (LED COLOR (www.szledcolor.com)) — datasheet
cdn-shop.adafruit.com/product-files/1138/SK6812+LED+datas...
STM32F765VI (STMicroelectronics) — datasheet
www.st.com/resource/en/datasheet/stm32f765vi.pdf
nRF24L01P (Nordic Semiconductor ASA) — datasheet
datasheet.lcsc.com/datasheet/pdf/1f70bc6ad7df407cb308db24...

14 Design-for-Test

Design for Testability (DFT) analysis for ICT/bed-of-nails test coverage.

14.1 DFx Options Selected

OptionSettingDescription
Test Point Insertion
Insert on power railsYesPlace test points on power rail nets in schematic
Insert on LSSI busesYesPlace test points on every LSSI bus signal (JTAG, SWD, I2C, I3C, MDIO, SPI, QSPI, UART) that has none
Insert on all netsNoExtend TP insertion to signal nets beyond power rails
Insert on feedback pinsYesPlace a test point on each regulator feedback / set net that has none, so its divider can be checked
Insert on power-good netsNoPlace a test point on each used power-good net that has none and no boundary scan
Insert on NVM programming netsNoPlace test points on the nets used to program on-board memory (QSPI, etc.)
Exclude HSSI netsYesExclude HSSI/differential pair nets from TP insertion
Exclude DRAM netsYesExclude SDRAM/DDR nets from TP insertion
Exclude BSCAN opens (full)YesExclude nets with 100% boundary scan opens coverage
Exclude BSCAN opens (partial)NoExclude nets with partial boundary scan opens coverage
Exclude BSCAN shortsNoExclude nets with boundary scan shorts coverage
GND test points6Number of GND test points to insert for BON fixture ground connections
Target PCOLA-SOQ0%Insert TPs in priority order until this PCOLA-SOQ % is reached
Target solder-joint testability0%Insert TPs in priority order until this shorts/opens solder-joint testability % is reached
Kelvin min resistance0.000 ohmLower bound (ohms) for Kelvin 4-wire TP insertion range
Kelvin max resistance1.000 ohmUpper bound (ohms) for Kelvin 4-wire TP insertion range
Tester Styles
OpticalManualVisual inspection for polarity, placement, and solder
AXIYesAutomated X-ray Inspection of hidden solder joints (BGA, QFN)
ATENoneNo automated test equipment
Test Access
JTAG/LSSI ConnectorYesConnector access to JTAG, SPI, I2C buses
IO ConnectorsNoIO connectors available for external stimulus/observation
TP AccessNoneNo physical probe access to test points
LoopbackNoneNo loopback cables
Test Types
Powered-Off Shorts/OpensNoUnpowered shorts and opens detection via probe access
PassivesNoR, C, L value measurement via probe or fixture access
Active AnalogNoVoltage regulator, reference, and op-amp output verification
Non-BSCAN DigitalNoDigital ICs without boundary scan: pin observability analysis
Boundary Scan1149.xIEEE 1149.1-2013 / 1149.6-2015 / 1149.10-2017 full boundary scan suite
LSSINoJTAG chain, SPI, I2C, UART bus test coverage analysis
JTAG FunctionalNoFunctional verification beyond structural scan
Require Rail TPs for Diode TestNoRequire TPs on all IO power rails for ESD diode opens test (default: basic test with GND TP only)
Capacitance Probe Plate Target Devices—Refdes or footprint patterns for capacitance probe plate targets (ICs and vertical connectors)
Use Boundary Scan for Capacitance Probe Plate StimulusNoCount boundary scan drive cells on other devices as valid stimulus for the capacitance probe plate (applicable to VTEP / IEEE 1149.8.1-capable hardware)
NVM Programming
Default MethodPre-programmedChips arrive pre-programmed; no programming access needed
Environment
Test environmentvolume_productionVolume production: fixture-based, AOI/AXI, throughput-optimized

14.2 Power Rail Test Point Check

Power rails found5
Rails with TPs5
Rails without TPs0
With designer annotation4
Parts adjudicated as TH: J2 (Conn_01x04_Pin), J12 (Conn_01x04_Pin), J9 (Conn_01x02_Pin), J10 (Conn_01x04_Pin), J11 (Conn_01x04_Pin), J8 (Conn_01x02_Pin), J7 (Conn_01x02_Pin), J3 (Conn_01x04_Pin), J5 (Conn_01x04_Pin). Their description and footprint do not say how they mount, so the mounting was looked up. If any is wrong, state SMT or TH/THT/THRU in the part's description.
10 test point(s) inserted in modified output. Download modified schematics to see placements.
Power Rail Coverage
Net NameAnnotationTest PointStatus
+3V3PWR_LOWJ10_1, J11_1, J12_1 (through-hole)✓
+5VPWR_LOWJ2_1, J3_1, J5_1 (through-hole)✓
+BATTJ8_2 (through-hole)✓
GNDPWR_LOWH1_1, H2_1, H3_1, H4_1, J1_1, J10_4, J11_4, J12_4, J2_6, J3_4, J4_1, J5_6, J7_1, J8_1, J9_1 (through-hole)✓
VCCPWR_HIGHJ9_2 (through-hole)✓
Inserted Test Points (Modified Output)
Test PointNetSheet
TP3GNDcaiman.kicad_sch
TP6GNDcaiman.kicad_sch
TP7GNDcaiman.kicad_sch
TP8GNDcaiman.kicad_sch
TP9GNDcaiman.kicad_sch
TP10GNDcaiman.kicad_sch
Signal Net Test Points (Modified Output)
Test PointNetSheet
TP1MOSIcaiman.kicad_sch
TP2CSNcaiman.kicad_sch
TP4MISOcaiman.kicad_sch
TP5SCKcaiman.kicad_sch

14.3 Unconnected 2-Pin Passives

Fitted 2-pin passives (capacitors, resistors, inductors) with a pin that reaches no net. These may be intentional unused or spare footprints, but each is pointed out for review.

ICTypeIssue
R1822 ohmPin R18.2 connects only to J6, which this variant does not fit - the passive is fitted but serves no circuit on this board.
R1622 ohmPin R16.2 connects only to J6, which this variant does not fit - the passive is fitted but serves no circuit on this board.
R1722 ohmPin R17.2 connects only to J6, which this variant does not fit - the passive is fitted but serves no circuit on this board.

14.4 Current Test Points

Total test points0
No test points found in design.

14.5 Boundary Scan Testability

No boundary scan capable devices were found in this design.

14.6 Inspection

Total: 115 components, 426 of 434 pins with inspection coverage.

14.6.1 Manual Optical

Solder joint coverage is analyzed as if AOI were available. Manual inspection may not detect all opens or shorts present.
Package Identified from the Footprint Name (Non-IPC Footprints)
Footprint names are not IPC-7351B or IPC-7251, but each one names its package: a chip size code (0201 or larger) or a package name such as SOT, SOIC or QFP. These solder joints count toward inspection coverage.
FootprintSize (mil)Pkg TypeClassificationMethodCountPinsRefdes
Opens + Shorts (all joints visible)
Package_QFP
LQFP-100_14x14mm_P0.5mmQFP (Quad Flat Pack)Footprint1100U7
Package_TO_SOT_SMD
SOT-23-5SOT (Small Outline Transistor)Footprint15U10
SOT-23-6SOT (Small Outline Transistor)Footprint16U4
TSOT-23-6SOT (Small Outline Transistor)Footprint212U1, U2
Capacitor_SMD
C_0402_1005MetricChip PassiveFootprint size3570C12, C13, C14, C15, C16, C17, C18, C19 ...+27 more
C_0603_1608MetricChip PassiveFootprint size1428C1, C10, C2, C3, C4, C47, C49, C5 ...+6 more
Inductor_SMD
L_0402_1005MetricChip PassiveFootprint size36L3, L4, L5
Resistor_SMD
R_0402_1005MetricChip PassiveFootprint size1938R10, R11, R12, R13, R14, R15, R16, R17 ...+11 more
R_0603_1608MetricChip PassiveFootprint size816R1, R2, R3, R30, R4, R5, R6, R7
PCM_Diode_SMD_AKL
D_SOD-123F_ZenerSOD (Diode Package)Footprint12DZ1
Subtotal: 85 components, 283 pins
Opens only (leads visible, shorts unreliable)
Package_SO
PowerPAK_SO-8L_SingleSOIC/SOPFootprint15Q1
Subtotal: 1 components, 5 pins
Assumed Classification (Non-IPC Footprints)
Footprint names are not IPC-7351B or IPC-7251. Package type inferred from Pkg Type property or designator prefix. Classification may be incorrect.
FootprintSize (mil)Pkg TypeClassificationMethodCountPinsRefdes
Opens + Shorts (all joints visible)
Package_TO_SOT_SMD
TDSON-8-1SOT (Small Outline Transistor)Designator15Q2
PCM_Capacitor_SMD_AKL
CP_Elec_8x10Chip PassiveDesignator24C11, C48
PCM_Inductor_SMD_AKL
L_Wuerth_MAPI-4020Chip PassiveDesignator24L1, L2
LED_SMD
LED_SK6812_PLCC4_5.0x5.0mm_P3.2mmSOD (Diode Package)Designator312D2, D3, D4
PCM_Diode_SMD_Handsoldering_AKL
D_SMB_TVSSOD (Diode Package)Designator12D1
Subtotal: 9 components, 27 pins
Opens only (leads visible, shorts unreliable)
Package_TO_SOT_THT
TO-92SOIC/SOPDesignator13U3
Subtotal: 1 components, 3 pins
Presence check (manual verification)
Connector_AMASS
AMASS_XT30UPB-M_1x02_P5.0mm_VerticalConnectorDesignator12J7
AMASS_XT60-F_1x02_P7.20mm_VerticalConnectorDesignator12J9
AMASS_XT60-M_1x02_P7.20mm_VerticalConnectorDesignator12J8
Connector_Card
microSD_HC_Hirose_DM3AT-SF-PEJM5ConnectorDesignator110J13
Connector_Coaxial
U.FL_Hirose_U.FL-R-SMT-1_VerticalConnectorDesignator12J14
Connector_JST
JST_GH_BM04B-GHS-TBT_1x04-1MP_P1.25mm_VerticalConnectorDesignator416J10, J11, J12, J3
JST_GH_BM06B-GHS-TBT_1x06-1MP_P1.25mm_VerticalConnectorDesignator212J2, J5
Connector_PinHeader_2.54mm
PinHeader_1x03_P2.54mm_VerticalConnectorDesignator26J1, J4
Subtotal: 13 components, 52 pins

14.6.2 AXI

Package Identified from the Footprint Name (Non-IPC Footprints)
Footprint names are not IPC-7351B or IPC-7251, but each one names its package (QFN, DFN, BGA or LGA). These hidden joints count toward X-ray inspection coverage.
FootprintSize (mil)Pkg TypeClassificationMethodCountPinsRefdes
Package_LGA
LGA-12_2x2mm_P0.5mmLGA (Land Grid Array)Footprint112U6
LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4yLGA (Land Grid Array)Footprint114U8
ST_HLGA-10_2x2mm_P0.5mm_LayoutBorder3x2yLGA (Land Grid Array)Footprint110U5
Package_DFN_QFN
QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mmQFN/DFN (No-Lead)Footprint120U9
Subtotal: 4 components, 56 pins

14.6.3 Unclassified Components

These components could not be classified for inspection. The library symbol lacks a Pkg Type property and the footprint name is not IPC-7351B or IPC-7251.
FootprintSize (mil)Pkg TypeClassificationMethodCountPinsRefdes
Crystal
Crystal_SMD_3225-4Pin_3.2x2.5mmOscillator / CrystalDesignator28Y1, Y2
Subtotal: 2 components, 8 pins

14.7 Solder-Joint Testability

Predicted status of each pin for shorts and opens based on DFx options selected in section 13.1.

14.7.1 Solder-Joint Testability Summary

Solder-Joint Testability Summary (451 solder joints)
Test MethodOpensShorts
X-ray (AXI)56 (12.4%)56 (12.4%)
Optical (AOI)288 (63.9%)283 (62.7%)
Electrical
   Powered-off Testing0 (0.0%)0 (0.0%)
   Boundary Scan0 (0.0%)0 (0.0%)
   LSSI43 (9.5%)43 (9.5%)
   Total94 (20.8%)221 (49.0%)
Total Solder-Joint Testability365 (80.9%)404 (89.6%)
No coverage86 (19.1%)47 (10.4%)

14.7.2 Untestable Solder Joints (46)

These pins have no electrical, optical, or X-ray test coverage even with all available test techniques applied.
Pin ⇅Net ⇅
D2_2Net-(D2-DIN)
D2_4Net-(D2-DOUT)
U3_3Net-(DZ1-A)
D4_2Net-(D3-DOUT)
D4_4Net-(D4-DOUT)
R28_1
R28_2
J6_1
J6_2
J6_3
J6_4
J6_5
J6_6
J4_2
J4_3THRL
J15_1
J15_2
J15_3
D3_2Net-(D2-DOUT)
D3_4Net-(D3-DOUT)
Y1_1Net-(U7-PH0)
Y1_4Net-(C28-Pad2)
Y2_1Net-(U9-XC2)
Y2_4Net-(U9-XC1)
D1_2Net-(D1-A)
L1_1Net-(U1-SW)
J13_9SD_Detect
J1_2
J1_3THRR
L2_1Net-(U2-SW)
J14_1Antenna
Q2_1Net-(D1-A)
Q2_2Net-(D1-A)
Q2_3Net-(D1-A)
Q2_4Net-(Q2-G)
R31_1
R31_2
J7_2Net-(D1-A)
R29_1
R29_2
R25_1
R25_2
J5_2TX1
J5_3RX1
J5_4
J5_5

14.7.3 Per-Solder-Joint Testability Matrix

● = Detected ◐ = Partially detected - = Not tested | E = Electrical (ICT/flying probe) O = Optical (AOI) X = X-ray (AXI)

Pin ⇅Net ⇅E Opens ⇅E Shorts ⇅O Opens ⇅O Shorts ⇅X Opens ⇅X Shorts ⇅
C45_1GND●●●◐--
C45_2Net-(U7-VCAP_2)--●◐--
R8_1NRST--●◐--
R8_2+3V3●●●◐--
C50_1GND-●●◐--
C50_2+5V-●●◐--
C16_1Net-(C16-Pad1)--●◐--
C16_2+3V3●●●◐--
D2_1GND-●----
D2_2Net-(D2-DIN)------
D2_3+5V-●----
D2_4Net-(D2-DOUT)------
J2_1+5V-●----
J2_2UART7_TX●◐----
J2_3UART7_RX●◐----
J2_4I2C2_SCL●◐----
J2_5I2C2_SDA●◐----
J2_6GND-●----
J12_1+3V3-●----
J12_2I2C2_SCL●◐----
J12_3I2C2_SDA●◐----
J12_4GND-●----
R23_1Net-(U7-PC9)--●◐--
R23_2DAT1●◐●◐--
C29_1GND●●●◐--
C29_2Net-(U6-C1)--●◐--
J9_1GND-●----
J9_2VCC-●----
C25_1+3V3-●●◐--
C25_2GND-●●◐--
R4_1VBAT-●●◐--
R4_2+BATT-●●◐--
C20_1GND●●●◐--
C20_2NRST--●◐--
C15_1Net-(C15-Pad1)--●◐--
C15_2+3V3●●●◐--
C39_1Net-(U9-XC1)--●◐--
C39_2GND●●●◐--
U3_1+BATT●●----
U3_2GND-●----
U3_3Net-(DZ1-A)------
R2_1VCC-●●◐--
R2_2GND-●●◐--
Q1_1+BATT-●●---
Q1_2+BATT-●●---
Q1_3+BATT-●●---
Q1_4Net-(DZ1-A)--●---
Q1_5VCC-●●---
D4_1GND-●----
D4_2Net-(D3-DOUT)------
D4_3+5V-●----
D4_4Net-(D4-DOUT)------
R28_1------
R28_2------
C49_1GND-●●◐--
C49_2+5V-●●◐--
J10_1+3V3-●----
J10_2I2C2_SCL●◐----
J10_3I2C2_SDA●◐----
J10_4GND-●----
L5_1Net-(U9-ANT2)--●◐--
L5_2Net-(C38-Pad1)--●◐--
R18_1Net-(U7-PB3)--●◐--
R18_2SWO--●◐--
C4_1GND-●●◐--
C4_2+5V-●●◐--
J6_1------
J6_2------
J6_3------
J6_4------
J6_5------
J6_6------
C12_1Net-(C12-Pad1)--●◐--
C12_2+3V3●●●◐--
U5_1+3V3-●--●◐
U5_10+3V3-●--●◐
U5_2I2C2_SCL●◐--●◐
U5_3GND-●--●◐
U5_4I2C2_SDA●◐--●◐
U5_5GND-●--●◐
U5_6+3V3-●--●◐
U5_7BAR_INT----●◐
U5_8GND-●--●◐
U5_9GND-●--●◐
R26_1Net-(U7-PC11)--●◐--
R26_2DAT3●◐●◐--
J4_1GND-●----
J4_2------
J4_3THRL------
C5_1GND-●●◐--
C5_2+5V-●●◐--
R10_1+3V3●●●◐--
R10_2DAT3●◐●◐--
J11_1+3V3-●----
J11_2I2C1_SCL●◐----
J11_3I2C1_SDA●◐----
J11_4GND-●----
C23_1+3V3-●●◐--
C23_2GND-●●◐--
R24_1Net-(U7-PC10)--●◐--
R24_2DAT2●◐●◐--
J15_1------
J15_2------
J15_3------
R20_1Net-(U9-IREF)--●◐--
R20_2GND●●●◐--
C9_1Net-(D1-A)--●◐--
C9_2GND●●●◐--
D3_1GND-●----
D3_2Net-(D2-DOUT)------
D3_3+5V-●----
D3_4Net-(D3-DOUT)------
R16_1Net-(U7-PA13)--●◐--
R16_2SWDIO--●◐--
C6_1GND-●●◐--
C6_2+5V-●●◐--
C1_1Net-(U1-SW)--●◐--
C1_2Net-(U1-BST)--●◐--
Y1_1Net-(U7-PH0)------
Y1_2GND-●----
Y1_3GND-●----
Y1_4Net-(C28-Pad2)------
C10_1Net-(U4-VCAP)--●◐--
C10_2Net-(D1-A)--●◐--
C44_1GND-●●◐--
C44_2+3V3-●●◐--
C17_1Net-(U7-VBAT)--●◐--
C17_2+3V3●●●◐--
L3_1Net-(U9-ANT1)--●◐--
L3_2Net-(U9-VDD_PA)--●◐--
C38_1Net-(C38-Pad1)--●◐--
C38_2Antenna--●◐--
C21_1Net-(U7-VREF+)--●◐--
C21_2+3V3●●●◐--
C41_1GND●●●◐--
C41_2Net-(U9-DVDD)--●◐--
U10_1--●◐--
U10_2LED--●◐--
U10_3GND-●●◐--
U10_4Net-(U10-Y)--●◐--
U10_5+5V-●●◐--
C27_1GND-●●◐--
C27_2+3V3-●●◐--
R7_1VCHG--●◐--
R7_2GND●●●◐--
R17_1Net-(U7-PA14)--●◐--
R17_2SWCLK--●◐--
C43_1GND-●●◐--
C43_2+3V3-●●◐--
C8_1GND-●●◐--
C8_2+3V3-●●◐--
Y2_1Net-(U9-XC2)------
Y2_2GND-●----
Y2_3GND-●----
Y2_4Net-(U9-XC1)------
C24_1GND●●●◐--
C24_2Net-(U7-PH0)--●◐--
C37_1GND-●●◐--
C37_2Antenna--●◐--
U7_1--●◐--
U7_10GND●●●◐--
U7_100Net-(C16-Pad1)--●◐--
U7_11Net-(C15-Pad1)--●◐--
U7_12Net-(U7-PH0)--●◐--
U7_13Net-(U7-PH1)--●◐--
U7_14NRST--●◐--
U7_15VBAT-●●◐--
U7_16VCHG--●◐--
U7_17--●◐--
U7_18--●◐--
U7_19GND●●●◐--
U7_2--●◐--
U7_20Net-(U7-VREF+)--●◐--
U7_21Net-(U7-VDDA)--●◐--
U7_22--●◐--
U7_23--●◐--
U7_24IRQ--●◐--
U7_25CSN--●◐--
U7_26GND●●●◐--
U7_27Net-(C13-Pad1)--●◐--
U7_28CE--●◐--
U7_29SCK--●◐--
U7_3--●◐--
U7_30MISO--●◐--
U7_31MOSI--●◐--
U7_32--●◐--
U7_33--●◐--
U7_34--●◐--
U7_35--●◐--
U7_36--●◐--
U7_37UART7_RX●◐●◐--
U7_38UART7_TX●◐●◐--
U7_39--●◐--
U7_4--●◐--
U7_40--●◐--
U7_41--●◐--
U7_42--●◐--
U7_43--●◐--
U7_44--●◐--
U7_45--●◐--
U7_46I2C2_SCL●◐●◐--
U7_47I2C2_SDA●◐●◐--
U7_48Net-(U7-VCAP_1)--●◐--
U7_49GND●●●◐--
U7_5--●◐--
U7_50Net-(C12-Pad1)--●◐--
U7_51UART5_RX--●◐--
U7_52UART5_TX--●◐--
U7_53USART1_TX--●◐--
U7_54USART1_RX--●◐--
U7_55USART3_TX--●◐--
U7_56USART3_RX--●◐--
U7_57--●◐--
U7_58--●◐--
U7_59THRR--●◐--
U7_6Net-(U7-VBAT)--●◐--
U7_60THRL--●◐--
U7_61--●◐--
U7_62SD_Detect--●◐--
U7_63LED--●◐--
U7_64--●◐--
U7_65Net-(U7-PC8)--●◐--
U7_66Net-(U7-PC9)--●◐--
U7_67--●◐--
U7_68--●◐--
U7_69--●◐--
U7_7--●◐--
U7_70UART4_RX●◐●◐--
U7_71UART4_TX●◐●◐--
U7_72Net-(U7-PA13)--●◐--
U7_73Net-(U7-VCAP_2)--●◐--
U7_74GND●●●◐--
U7_75Net-(C18-Pad1)--●◐--
U7_76Net-(U7-PA14)--●◐--
U7_77--●◐--
U7_78Net-(U7-PC10)--●◐--
U7_79Net-(U7-PC11)--●◐--
U7_8--●◐--
U7_80Net-(U7-PC12)--●◐--
U7_81--●◐--
U7_82--●◐--
U7_83Net-(U7-PD2)--●◐--
U7_84--●◐--
U7_85--●◐--
U7_86--●◐--
U7_87--●◐--
U7_88--●◐--
U7_89Net-(U7-PB3)--●◐--
U7_9--●◐--
U7_90--●◐--
U7_91--●◐--
U7_92I2C1_SCL●◐●◐--
U7_93I2C1_SDA●◐●◐--
U7_94--●◐--
U7_95--●◐--
U7_96--●◐--
U7_97UART8_RX--●◐--
U7_98UART8_TX--●◐--
U7_99GND●●●◐--
C47_1GND-●●◐--
C47_2+5V-●●◐--
C3_1GND-●●◐--
C3_2VCC-●●◐--
C22_1+3V3-●●◐--
C22_2GND-●●◐--
C28_1GND●●●◐--
C28_2Net-(C28-Pad2)--●◐--
U8_1GND-●--●◐
U8_10----●◐
U8_11----●◐
U8_12+3V3-●--●◐
U8_13I2C2_SCL●◐--●◐
U8_14I2C2_SDA●◐--●◐
U8_2GND-●--●◐
U8_3GND-●--●◐
U8_4IMU_INT----●◐
U8_5+3V3-●--●◐
U8_6GND-●--●◐
U8_7GND-●--●◐
U8_8+3V3-●--●◐
U8_9----●◐
C36_1Net-(U9-VDD_PA)--●◐--
C36_2GND●●●◐--
U2_1+3V3●●●◐--
U2_2+5V-●●◐--
U2_3+5V-●●◐--
U2_4GND-●●◐--
U2_5Net-(U2-SW)--●◐--
U2_6Net-(U2-BST)--●◐--
R27_1Net-(U7-PC12)--●◐--
R27_2CLK●◐●◐--
R13_1DAT0●◐●◐--
R13_2+3V3●●●◐--
D1_1GND-●----
D1_2Net-(D1-A)------
L1_1Net-(U1-SW)------
L1_2+5V●●----
J13_1DAT2●◐----
J13_10GND-●----
J13_2DAT3●◐----
J13_3CMD●◐----
J13_4+3V3-●----
J13_5CLK●◐----
J13_6GND-●----
J13_7DAT0●◐----
J13_8DAT1●◐----
J13_9SD_Detect------
C35_1Net-(U9-VDD_PA)--●◐--
C35_2GND●●●◐--
R15_1SD_Detect--●◐--
R15_2+3V3●●●◐--
R6_1VCHG--●◐--
R6_2Net-(D1-A)--●◐--
C13_1Net-(C13-Pad1)--●◐--
C13_2+3V3●●●◐--
U9_1CE----●◐
U9_10Net-(U9-XC1)----●◐
U9_11Net-(U9-VDD_PA)----●◐
U9_12Net-(U9-ANT1)----●◐
U9_13Net-(U9-ANT2)----●◐
U9_14GND●●--●◐
U9_15+3V3-●--●◐
U9_16Net-(U9-IREF)----●◐
U9_17GND●●--●◐
U9_18+3V3-●--●◐
U9_19Net-(U9-DVDD)----●◐
U9_2CSN----●◐
U9_20GND●●--●◐
U9_3SCK----●◐
U9_4MOSI----●◐
U9_5MISO----●◐
U9_6IRQ----●◐
U9_7+3V3-●--●◐
U9_8GND●●--●◐
U9_9Net-(U9-XC2)----●◐
J1_1GND-●----
J1_2------
J1_3THRR------
C46_1Net-(U9-XC2)--●◐--
C46_2GND●●●◐--
C7_1GND-●●◐--
C7_2+3V3-●●◐--
U4_1Net-(U4-VCAP)--●◐--
U4_2GND●●●◐--
U4_3Net-(D1-A)--●◐--
U4_4+BATT-●●◐--
U4_5Net-(Q2-G)--●◐--
U4_6Net-(D1-A)--●◐--
C30_1+3V3-●●◐--
C30_2GND-●●◐--
C14_1Net-(U7-VDDA)--●◐--
C14_2+3V3●●●◐--
U1_1+5V●●●◐--
U1_2Net-(U1-EN)--●◐--
U1_3VCC●●●◐--
U1_4GND-●●◐--
U1_5Net-(U1-SW)--●◐--
U1_6Net-(U1-BST)--●◐--
R5_1GND-●●◐--
R5_2VBAT-●●◐--
R3_1+BATT●●●◐--
R3_2Net-(DZ1-A)--●◐--
R14_1DAT1●◐●◐--
R14_2+3V3●●●◐--
R19_1Net-(U7-PD2)--●◐--
R19_2CMD●◐●◐--
C19_1Net-(U7-VREF+)--●◐--
C19_2+3V3●●●◐--
L2_1Net-(U2-SW)------
L2_2+3V3●●----
C48_1+5V-●----
C48_2GND-●----
C26_1+3V3-●●◐--
C26_2GND-●●◐--
C32_1GND-●●◐--
C32_2+3V3-●●◐--
J14_1Antenna------
J14_2GND-●----
R21_1Net-(U7-PC8)--●◐--
R21_2DAT0●◐●◐--
R1_1Net-(U1-EN)--●◐--
R1_2VCC●●●◐--
R30_1Net-(U10-Y)--●◐--
R30_2Net-(D2-DIN)--●◐--
Q2_1Net-(D1-A)------
Q2_2Net-(D1-A)------
Q2_3Net-(D1-A)------
Q2_4Net-(Q2-G)------
Q2_5+BATT-●----
R12_1Net-(U7-PH1)--●◐--
R12_2Net-(C28-Pad2)--●◐--
C51_1GND-●●◐--
C51_2+5V-●●◐--
C31_1+3V3-●●◐--
C31_2GND-●●◐--
C34_1+3V3-●●◐--
C34_2GND-●●◐--
R31_1------
R31_2------
R11_1+3V3●●●◐--
R11_2CMD●◐●◐--
C42_1Net-(U7-VCAP_1)--●◐--
C42_2GND●●●◐--
J8_1GND-●----
J8_2+BATT-●----
J7_1GND-●----
J7_2Net-(D1-A)------
R29_1------
R29_2------
R25_1------
R25_2------
J3_1+5V-●----
J3_2UART4_TX●◐----
J3_3UART4_RX●◐----
J3_4GND-●----
R9_1+3V3●●●◐--
R9_2DAT2●◐●◐--
C11_1GND-●----
C11_2+BATT-●----
U6_1I2C2_SCL●◐--●◐
U6_10+3V3-●--●◐
U6_11----●◐
U6_12----●◐
U6_2----●◐
U6_3+3V3-●--●◐
U6_4I2C2_SDA●◐--●◐
U6_5Net-(U6-C1)----●◐
U6_6GND●●--●◐
U6_7MAG_INT----●◐
U6_8GND●●--●◐
U6_9+3V3-●--●◐
C33_1+3V3-●●◐--
C33_2GND-●●◐--
R22_1Net-(U9-XC1)--●◐--
R22_2Net-(U9-XC2)--●◐--
C2_1Net-(U2-SW)--●◐--
C2_2Net-(U2-BST)--●◐--
C40_1GND-●●◐--
C40_2+3V3-●●◐--
L4_1Net-(U9-ANT1)--●◐--
L4_2Net-(U9-ANT2)--●◐--
J5_1+5V-●----
J5_2TX1------
J5_3RX1------
J5_4------
J5_5------
J5_6GND-●----
C18_1Net-(C18-Pad1)--●◐--
C18_2+3V3●●●◐--
DZ1_1+BATT-●●◐--
DZ1_2Net-(DZ1-A)--●◐--

14.8 PCOLA/SOQ Testability

PCOLA/SOQ scores how well the configured test methods cover each component and each connection. PCOLA evaluates five device-level properties: Presence, Correctness, Orientation, Live (functional), and Alignment. SOQ evaluates three connection-level properties: Shorts detection, Opens detection, and solder joint Quality. Scores are on a 0–100,000 scale where 100,000 means every property is fully covered. The Combined score is the average of PCOLA and SOQ.

14.8.1 Coverage by Test Method

P=Presence C=Correctness O=Orientation L=Live A=Alignment | S=Shorts O(pins)=Opens Q=Quality

PCOLA/SOQ coverage scores by test method. Scores: 0 (None), 0.5 (Partial), 1.0 (Full).
Test MethodPCOLASOpensSolder Quality
Electrical Test43.9%0.0%0.0%10.5%0.0%25.5%21.7%0.0%
Optical Inspection (AOI)78.3%8.7%43.5%0.0%37.4%32.6%33.2%33.2%
X-Ray Inspection (AXI)0.0%0.0%0.0%0.0%1.7%6.5%6.5%6.5%
Combined89.1%8.7%43.5%10.5%39.1%46.5%52.9%39.6%

14.8.2 PCB Device/Pin Count

Devices (PCOLA): 115
Pins (SOQ): 434

14.8.3 Board-Level Scores

Board-Level Coverage (0 – 100,000 scale)
DimensionScoreCoverage
PCOLA38192 / 100,00038.2%
SOQ46352 / 100,00046.4%
Combined42272 / 100,00042.3%
Electrical vs Inspection
SourcePCOLA ScoreSOQ Score
Electrical Test10888 / 100,00015707 / 100,000
Optical/X-ray Inspection33913 / 100,00039439 / 100,000
Combined (max)38192 / 100,00046352 / 100,000

14.8.4 PCOLA (115 devices)

● = Full (1.0) ◐ = Partial (0.5) ○ = None (0) — = N/A (excluded)
* Footprint not IPC-7351B/7251 compliant — no inspection coverage scored

Score ⇅RefDes ⇅Type / Footprint ⇅Class ⇅P ⇅C ⇅O ⇅L ⇅A ⇅Method ⇅
80%U6LIS2MDLTR / LGA-12_2x2mm_P0.5mmIC●●●◐◐AOI, AXI, LSSI, Powered_Off
80%U8LSM6DSO / LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4yIC●●●◐◐AOI, AXI, LSSI, Powered_Off
80%U5LPS22HBTR / ST_HLGA-10_2x2mm_P0.5mm_LayoutBorder3x2yIC●●●◐◐AOI, AXI, LSSI, Powered_Off
80%U7STM32F765VITx / LQFP-100_14x14mm_P0.5mmIC●●●◐◐AOI, LSSI, Powered_Off
70%U9nRF24L01P / QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mmIC●●●○◐AOI, AXI, Powered_Off
70%U4LM74700 / SOT-23-6IC●●●○◐AOI, Powered_Off
70%U10SN74LV1T34DBV / SOT-23-5IC●●●○◐AOI, Powered_Off
70%Q1Q_PMOS-E_Generic_SSSGD / PowerPAK_SO-8L_SingleTransistor●●●○◐AOI, Powered_Off
70%U1AP63205WU / TSOT-23-6IC●●●○◐AOI, Powered_Off
70%U2AP63203WU / TSOT-23-6IC●●●○◐AOI, Powered_Off
40%C452.2uF / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%R810k / R_0402_1005MetricResistor●○◐—◐AOI, Powered_Off
40%C500.1uF / C_0603_1608MetricCapacitor●○◐—◐AOI, Powered_Off
40%C16100nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C3310nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%R221M / R_0402_1005MetricResistor●○◐—◐AOI
40%C2100nF / C_0603_1608MetricCapacitor●○◐—◐AOI
40%R2322ohm / R_0402_1005MetricResistor●○◐—◐AOI, Powered_Off
40%C29220nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C40100nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C254.7uF / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%R4100k / R_0603_1608MetricResistor●○◐—◐AOI, Powered_Off
40%C20100nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C15100nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C3922pF / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%L48.2nH / L_0402_1005MetricInductor●○◐—◐AOI
40%R215k / R_0603_1608MetricResistor●○◐—◐AOI, Powered_Off
40%C18100nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C490.1uF / C_0603_1608MetricCapacitor●○◐—◐AOI, Powered_Off
40%L53.9nH / L_0402_1005MetricInductor●○◐—◐AOI
40%R1822 ohm / R_0402_1005MetricResistor●○◐—◐AOI
40%C422uF / C_0603_1608MetricCapacitor●○◐—◐AOI, Powered_Off
40%C12100nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%R2622ohm / R_0402_1005MetricResistor●○◐—◐AOI, Powered_Off
40%C522uF / C_0603_1608MetricCapacitor●○◐—◐AOI, Powered_Off
40%R1010k / R_0402_1005MetricResistor●○◐—◐AOI, Powered_Off
40%C23100nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%R2422ohm / R_0402_1005MetricResistor●○◐—◐AOI, Powered_Off
40%R2022k / R_0402_1005MetricResistor●○◐—◐AOI, Powered_Off
40%C90.1uF / C_0603_1608MetricCapacitor●○◐—◐AOI, Powered_Off
40%R1622 ohm / R_0402_1005MetricResistor●○◐—◐AOI
40%C610uF / C_0603_1608MetricCapacitor●○◐—◐AOI, Powered_Off
40%C1100nF / C_0603_1608MetricCapacitor●○◐—◐AOI
40%C100.1uF / C_0603_1608MetricCapacitor●○◐—◐AOI
40%C4410uf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C17100nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%L32.7nH / L_0402_1005MetricInductor●○◐—◐AOI
40%C381.5pF / C_0402_1005MetricCapacitor●○◐—◐AOI
40%C211uF / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C4133nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C27100nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%R727k / R_0603_1608MetricResistor●○◐—◐AOI, Powered_Off
40%R1722 ohm / R_0402_1005MetricResistor●○◐—◐AOI
40%C43100nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C822uF / C_0603_1608MetricCapacitor●○◐—◐AOI, Powered_Off
40%C2418pF / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C371pF / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C470.1uF / C_0603_1608MetricCapacitor●○◐—◐AOI, Powered_Off
40%C310uF / C_0603_1608MetricCapacitor●○◐—◐AOI, Powered_Off
40%C224.7uf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C2818pF / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C364.7pF / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%R2722ohm / R_0402_1005MetricResistor●○◐—◐AOI, Powered_Off
40%R1310k / R_0402_1005MetricResistor●○◐—◐AOI, Powered_Off
40%C352.2nF / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%R1510k / R_0402_1005MetricResistor●○◐—◐AOI, Powered_Off
40%R6100k / R_0603_1608MetricResistor●○◐—◐AOI
40%C13100nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C4622pF / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C722uF / C_0603_1608MetricCapacitor●○◐—◐AOI, Powered_Off
40%C3010uf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C14100nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%R527k / R_0603_1608MetricResistor●○◐—◐AOI, Powered_Off
40%R310k / R_0603_1608MetricResistor●○◐—◐AOI, Powered_Off
40%R1410k / R_0402_1005MetricResistor●○◐—◐AOI, Powered_Off
40%R1922ohm / R_0402_1005MetricResistor●○◐—◐AOI, Powered_Off
40%C19100nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C422.2uF / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C26100nF / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C32100nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%R2122ohm / R_0402_1005MetricResistor●○◐—◐AOI, Powered_Off
40%R1100k / R_0603_1608MetricResistor●○◐—◐AOI, Powered_Off
40%R30330 / R_0603_1608MetricResistor●○◐—◐AOI
40%R1247k / R_0402_1005MetricResistor●○◐—◐AOI
40%C510.1uF / C_0603_1608MetricCapacitor●○◐—◐AOI, Powered_Off
40%C31100nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%C341nf / C_0402_1005MetricCapacitor●○◐—◐AOI, Powered_Off
40%R1110k / R_0402_1005MetricResistor●○◐—◐AOI, Powered_Off
40%DZ1MMSZ5245 / D_SOD-123F_ZenerDiode●○◐○◐AOI, Powered_Off
40%R910k / R_0402_1005MetricResistor●○◐—◐AOI, Powered_Off
10%D2SK6812 / LED_SK6812_PLCC4_5.0x5.0mm_P3.2mm *Diode◐○○○○Powered_Off
10%J2Conn_01x04_Pin / JST_GH_BM06B-GHS-TBT_1x06-1MP_P1.25mm_Vertical *Connector◐○○—○Powered_Off
10%J12Conn_01x04_Pin / JST_GH_BM04B-GHS-TBT_1x04-1MP_P1.25mm_Vertical *Connector◐○○—○Powered_Off
10%J9Conn_01x02_Pin / AMASS_XT60-F_1x02_P7.20mm_Vertical *Connector◐○○—○Powered_Off
10%U3US1881 / TO-92 *IC◐○○○○Powered_Off
10%D4SK6812 / LED_SK6812_PLCC4_5.0x5.0mm_P3.2mm *Diode◐○○○○Powered_Off
10%J13Micro_SD_Card / microSD_HC_Hirose_DM3AT-SF-PEJM5 *Connector◐○○—○Powered_Off
10%Y216MHz / Crystal_SMD_3225-4Pin_3.2x2.5mm *Other◐○○○○Powered_Off
10%J11Conn_01x04_Pin / JST_GH_BM04B-GHS-TBT_1x04-1MP_P1.25mm_Vertical *Connector◐○○—○Powered_Off
10%C48470uF / CP_Elec_8x10 *Capacitor◐○○—○Powered_Off
10%Y125MHz / Crystal_SMD_3225-4Pin_3.2x2.5mm *Other◐○○○○Powered_Off
10%J8Conn_01x02_Pin / AMASS_XT60-M_1x02_P7.20mm_Vertical *Connector◐○○—○Powered_Off
10%J7Conn_01x02_Pin / AMASS_XT30UPB-M_1x02_P5.0mm_Vertical *Connector◐○○—○Powered_Off
10%J3Conn_01x04_Pin / JST_GH_BM04B-GHS-TBT_1x04-1MP_P1.25mm_Vertical *Connector◐○○—○Powered_Off
10%D1SMBJ33CA / D_SMB_TVS *Diode◐○○○○Powered_Off
10%C1147uF / CP_Elec_8x10 *Capacitor◐○○—○Powered_Off
10%J10Conn_01x04_Pin / JST_GH_BM04B-GHS-TBT_1x04-1MP_P1.25mm_Vertical *Connector◐○○—○Powered_Off
10%J1450 ohm / U.FL_Hirose_U.FL-R-SMT-1_Vertical *Connector◐○○—○Powered_Off
10%J4Conn_01x03_Pin / PinHeader_1x03_P2.54mm_Vertical *Connector◐○○—○Powered_Off
10%L13.3uH / L_Wuerth_MAPI-4020 *Inductor◐○○—○Powered_Off
10%D3SK6812 / LED_SK6812_PLCC4_5.0x5.0mm_P3.2mm *Diode◐○○○○Powered_Off
10%Q2AON6262E / TDSON-8-1 *Transistor◐○○○○Powered_Off
10%J5Conn_01x04_Pin / JST_GH_BM06B-GHS-TBT_1x06-1MP_P1.25mm_Vertical *Connector◐○○—○Powered_Off
10%J1Conn_01x03_Pin / PinHeader_1x03_P2.54mm_Vertical *Connector◐○○—○Powered_Off
10%L22.2uH / L_Wuerth_MAPI-4020 *Inductor◐○○—○Powered_Off

14.8.5 SOQ (434 solder joints)

● = Full (1.0) ◐ = Partial (0.5) ○ = None (0)

Score ⇅Pin ⇅Net ⇅S ⇅O ⇅Q ⇅
67%C45_1GND◐●◐
67%U5_2I2C2_SCL◐●◐
67%U8_14I2C2_SDA◐●◐
67%R8_2+3V3◐●◐
67%U5_4I2C2_SDA◐●◐
67%U8_13I2C2_SCL◐●◐
67%C28_1GND◐●◐
67%C16_2+3V3◐●◐
67%R9_2DAT2◐●◐
67%R9_1+3V3◐●◐
67%C42_2GND◐●◐
67%R11_2CMD◐●◐
67%R11_1+3V3◐●◐
67%U7_49GND◐●◐
67%U7_37UART7_RX◐●◐
67%U7_26GND◐●◐
67%R7_2GND◐●◐
67%R1_2VCC◐●◐
67%R21_2DAT0◐●◐
67%R26_2DAT3◐●◐
67%U9_20GND◐●◐
67%C19_2+3V3◐●◐
67%U9_17GND◐●◐
67%R23_2DAT1◐●◐
67%C29_1GND◐●◐
67%U9_14GND◐●◐
67%R19_2CMD◐●◐
67%R14_2+3V3◐●◐
67%U7_10GND◐●◐
67%C17_2+3V3◐●◐
67%R10_1+3V3◐●◐
67%R10_2DAT3◐●◐
67%C20_1GND◐●◐
67%C13_2+3V3◐●◐
67%U7_19GND◐●◐
67%C15_2+3V3◐●◐
67%U7_38UART7_TX◐●◐
67%C39_2GND◐●◐
67%R15_2+3V3◐●◐
67%R14_1DAT1◐●◐
67%R3_1+BATT◐●◐
67%U7_46I2C2_SCL◐●◐
67%U7_47I2C2_SDA◐●◐
67%U7_71UART4_TX◐●◐
67%R24_2DAT2◐●◐
67%C21_2+3V3◐●◐
67%U1_3VCC◐●◐
67%R20_2GND◐●◐
67%U1_1+5V◐●◐
67%C14_2+3V3◐●◐
67%U4_2GND◐●◐
67%C46_2GND◐●◐
67%C41_1GND◐●◐
67%C9_2GND◐●◐
67%C36_2GND◐●◐
67%C35_2GND◐●◐
67%R13_2+3V3◐●◐
67%U9_8GND◐●◐
67%R13_1DAT0◐●◐
67%R27_2CLK◐●◐
67%U7_99GND◐●◐
67%U7_93I2C1_SDA◐●◐
67%U7_92I2C1_SCL◐●◐
67%U7_74GND◐●◐
67%C24_1GND◐●◐
67%C12_2+3V3◐●◐
67%U7_70UART4_RX◐●◐
67%U2_1+3V3◐●◐
67%U6_1I2C2_SCL◐●◐
67%U6_4I2C2_SDA◐●◐
67%U6_6GND◐●◐
67%U6_8GND◐●◐
67%C18_2+3V3◐●◐
50%J2_2UART7_TX◐●○
50%J2_3UART7_RX◐●○
50%J2_4I2C2_SCL◐●○
50%J2_5I2C2_SDA◐●○
50%J12_2I2C2_SCL◐●○
50%J12_3I2C2_SDA◐●○
50%R23_1Net-(U7-PC9)◐◐◐
50%C29_2Net-(U6-C1)◐◐◐
50%C25_1+3V3◐◐◐
50%C25_2GND◐◐◐
50%R4_1VBAT◐◐◐
50%R4_2+BATT◐◐◐
50%C20_2NRST◐◐◐
50%C15_1Net-(C15-Pad1)◐◐◐
50%C39_1Net-(U9-XC1)◐◐◐
50%U3_1+BATT◐●○
50%R2_1VCC◐◐◐
50%R2_2GND◐◐◐
50%Q1_1+BATT◐◐◐
50%Q1_2+BATT◐◐◐
50%Q1_3+BATT◐◐◐
50%Q1_5VCC◐◐◐
50%C49_1GND◐◐◐
50%C49_2+5V◐◐◐
50%J10_2I2C2_SCL◐●○
50%J10_3I2C2_SDA◐●○
50%L5_1Net-(U9-ANT2)◐◐◐
50%L5_2Net-(C38-Pad1)◐◐◐
50%R18_1Net-(U7-PB3)◐◐◐
50%R18_2SWO◐◐◐
50%C4_1GND◐◐◐
50%C4_2+5V◐◐◐
50%C12_1Net-(C12-Pad1)◐◐◐
50%U5_1+3V3◐◐◐
50%U5_10+3V3◐◐◐
50%U5_3GND◐◐◐
50%U5_5GND◐◐◐
50%U5_6+3V3◐◐◐
50%U5_7BAR_INT◐◐◐
50%U5_8GND◐◐◐
50%U5_9GND◐◐◐
50%R26_1Net-(U7-PC11)◐◐◐
50%C5_1GND◐◐◐
50%C5_2+5V◐◐◐
50%J11_2I2C1_SCL◐●○
50%J11_3I2C1_SDA◐●○
50%C23_1+3V3◐◐◐
50%C23_2GND◐◐◐
50%R24_1Net-(U7-PC10)◐◐◐
50%R20_1Net-(U9-IREF)◐◐◐
50%C9_1Net-(D1-A)◐◐◐
50%R16_1Net-(U7-PA13)◐◐◐
50%R16_2SWDIO◐◐◐
50%C6_1GND◐◐◐
50%C6_2+5V◐◐◐
50%C1_1Net-(U1-SW)◐◐◐
50%C1_2Net-(U1-BST)◐◐◐
50%C10_1Net-(U4-VCAP)◐◐◐
50%C10_2Net-(D1-A)◐◐◐
50%C44_1GND◐◐◐
50%C44_2+3V3◐◐◐
50%C17_1Net-(U7-VBAT)◐◐◐
50%L3_1Net-(U9-ANT1)◐◐◐
50%L3_2Net-(U9-VDD_PA)◐◐◐
50%C38_1Net-(C38-Pad1)◐◐◐
50%C38_2Antenna◐◐◐
50%C21_1Net-(U7-VREF+)◐◐◐
50%C41_2Net-(U9-DVDD)◐◐◐
50%U10_1◐◐◐
50%U10_2LED◐◐◐
50%U10_3GND◐◐◐
50%U10_4Net-(U10-Y)◐◐◐
50%U10_5+5V◐◐◐
50%C27_1GND◐◐◐
50%C27_2+3V3◐◐◐
50%R7_1VCHG◐◐◐
50%R17_1Net-(U7-PA14)◐◐◐
50%R17_2SWCLK◐◐◐
50%C43_1GND◐◐◐
50%C43_2+3V3◐◐◐
50%C8_1GND◐◐◐
50%C8_2+3V3◐◐◐
50%C24_2Net-(U7-PH0)◐◐◐
50%C37_1GND◐◐◐
50%C37_2Antenna◐◐◐
50%U7_1◐◐◐
50%U7_100Net-(C16-Pad1)◐◐◐
50%U7_11Net-(C15-Pad1)◐◐◐
50%U7_12Net-(U7-PH0)◐◐◐
50%U7_13Net-(U7-PH1)◐◐◐
50%U7_14NRST◐◐◐
50%U7_15VBAT◐◐◐
50%U7_16VCHG◐◐◐
50%U7_17◐◐◐
50%U7_18◐◐◐
50%U7_2◐◐◐
50%U7_20Net-(U7-VREF+)◐◐◐
50%U7_21Net-(U7-VDDA)◐◐◐
50%U7_23◐◐◐
50%U7_24IRQ◐◐◐
50%U7_25CSN◐◐◐
50%U7_27Net-(C13-Pad1)◐◐◐
50%U7_28CE◐◐◐
50%U7_29SCK◐◐◐
50%U7_3◐◐◐
50%U7_30MISO◐◐◐
50%U7_31MOSI◐◐◐
50%U7_32◐◐◐
50%U7_33◐◐◐
50%U7_34◐◐◐
50%U7_35◐◐◐
50%U7_36◐◐◐
50%U7_39◐◐◐
50%U7_4◐◐◐
50%U7_40◐◐◐
50%U7_41◐◐◐
50%U7_42◐◐◐
50%U7_43◐◐◐
50%U7_44◐◐◐
50%U7_45◐◐◐
50%U7_48Net-(U7-VCAP_1)◐◐◐
50%U7_5◐◐◐
50%U7_50Net-(C12-Pad1)◐◐◐
50%U7_51UART5_RX◐◐◐
50%U7_52UART5_TX◐◐◐
50%U7_53USART1_TX◐◐◐
50%U7_54USART1_RX◐◐◐
50%U7_55USART3_TX◐◐◐
50%U7_56USART3_RX◐◐◐
50%U7_57◐◐◐
50%U7_58◐◐◐
50%U7_59THRR◐◐◐
50%U7_6Net-(U7-VBAT)◐◐◐
50%U7_60THRL◐◐◐
50%U7_61◐◐◐
50%U7_62SD_Detect◐◐◐
50%U7_63LED◐◐◐
50%U7_64◐◐◐
50%U7_65Net-(U7-PC8)◐◐◐
50%U7_66Net-(U7-PC9)◐◐◐
50%U7_67◐◐◐
50%U7_68◐◐◐
50%U7_69◐◐◐
50%U7_7◐◐◐
50%DZ1_2Net-(DZ1-A)◐◐◐
50%U7_72Net-(U7-PA13)◐◐◐
50%U7_73Net-(U7-VCAP_2)◐◐◐
50%U7_75Net-(C18-Pad1)◐◐◐
50%U7_76Net-(U7-PA14)◐◐◐
50%U7_77◐◐◐
50%U7_78Net-(U7-PC10)◐◐◐
50%U7_79Net-(U7-PC11)◐◐◐
50%U7_8◐◐◐
50%U7_80Net-(U7-PC12)◐◐◐
50%U7_81◐◐◐
50%U7_82◐◐◐
50%U7_83Net-(U7-PD2)◐◐◐
50%U7_84◐◐◐
50%U7_85◐◐◐
50%U7_86◐◐◐
50%U7_87◐◐◐
50%U7_88◐◐◐
50%U7_89Net-(U7-PB3)◐◐◐
50%U7_9◐◐◐
50%U7_90◐◐◐
50%U7_91◐◐◐
50%U7_94◐◐◐
50%U7_95◐◐◐
50%U7_96◐◐◐
50%U7_97UART8_RX◐◐◐
50%U7_98UART8_TX◐◐◐
50%C47_1GND◐◐◐
50%C47_2+5V◐◐◐
50%C3_1GND◐◐◐
50%C3_2VCC◐◐◐
50%C22_1+3V3◐◐◐
50%C22_2GND◐◐◐
50%C28_2Net-(C28-Pad2)◐◐◐
50%U8_1GND◐◐◐
50%U8_10◐◐◐
50%U8_11◐◐◐
50%U8_12+3V3◐◐◐
50%U8_2GND◐◐◐
50%U8_3GND◐◐◐
50%U8_4IMU_INT◐◐◐
50%U8_5+3V3◐◐◐
50%U8_6GND◐◐◐
50%U8_7GND◐◐◐
50%U8_8+3V3◐◐◐
50%U8_9◐◐◐
50%C36_1Net-(U9-VDD_PA)◐◐◐
50%U7_22◐◐◐
50%U2_2+5V◐◐◐
50%U2_3+5V◐◐◐
50%U2_4GND◐◐◐
50%U2_5Net-(U2-SW)◐◐◐
50%U2_6Net-(U2-BST)◐◐◐
50%R27_1Net-(U7-PC12)◐◐◐
50%L1_2+5V◐●○
50%J13_1DAT2◐●○
50%J13_2DAT3◐●○
50%J13_3CMD◐●○
50%J13_5CLK◐●○
50%J13_7DAT0◐●○
50%J13_8DAT1◐●○
50%C35_1Net-(U9-VDD_PA)◐◐◐
50%R15_1SD_Detect◐◐◐
50%R6_1VCHG◐◐◐
50%R6_2Net-(D1-A)◐◐◐
50%C13_1Net-(C13-Pad1)◐◐◐
50%U9_1CE◐◐◐
50%U9_10Net-(U9-XC1)◐◐◐
50%U9_11Net-(U9-VDD_PA)◐◐◐
50%U9_12Net-(U9-ANT1)◐◐◐
50%U9_13Net-(U9-ANT2)◐◐◐
50%U9_15+3V3◐◐◐
50%U9_16Net-(U9-IREF)◐◐◐
50%U9_18+3V3◐◐◐
50%U9_19Net-(U9-DVDD)◐◐◐
50%U9_2CSN◐◐◐
50%U9_3SCK◐◐◐
50%U9_4MOSI◐◐◐
50%U9_5MISO◐◐◐
50%U9_6IRQ◐◐◐
50%U9_7+3V3◐◐◐
50%U9_9Net-(U9-XC2)◐◐◐
50%R12_2Net-(C28-Pad2)◐◐◐
50%C46_1Net-(U9-XC2)◐◐◐
50%C7_1GND◐◐◐
50%C7_2+3V3◐◐◐
50%U4_1Net-(U4-VCAP)◐◐◐
50%U4_3Net-(D1-A)◐◐◐
50%U4_4+BATT◐◐◐
50%U4_5Net-(Q2-G)◐◐◐
50%U4_6Net-(D1-A)◐◐◐
50%C30_1+3V3◐◐◐
50%C30_2GND◐◐◐
50%C14_1Net-(U7-VDDA)◐◐◐
50%U1_2Net-(U1-EN)◐◐◐
50%U1_4GND◐◐◐
50%U1_5Net-(U1-SW)◐◐◐
50%U1_6Net-(U1-BST)◐◐◐
50%R5_1GND◐◐◐
50%R5_2VBAT◐◐◐
50%R3_2Net-(DZ1-A)◐◐◐
50%R19_1Net-(U7-PD2)◐◐◐
50%C19_1Net-(U7-VREF+)◐◐◐
50%L2_2+3V3◐●○
50%C26_1+3V3◐◐◐
50%C26_2GND◐◐◐
50%C32_1GND◐◐◐
50%C32_2+3V3◐◐◐
50%R21_1Net-(U7-PC8)◐◐◐
50%R1_1Net-(U1-EN)◐◐◐
50%R30_1Net-(U10-Y)◐◐◐
50%R30_2Net-(D2-DIN)◐◐◐
50%R12_1Net-(U7-PH1)◐◐◐
50%C51_1GND◐◐◐
50%C51_2+5V◐◐◐
50%C31_1+3V3◐◐◐
50%C31_2GND◐◐◐
50%C34_1+3V3◐◐◐
50%C34_2GND◐◐◐
50%C42_1Net-(U7-VCAP_1)◐◐◐
50%J3_2UART4_TX◐●○
50%J3_3UART4_RX◐●○
50%C45_2Net-(U7-VCAP_2)◐◐◐
50%U6_10+3V3◐◐◐
50%U6_11◐◐◐
50%U6_12◐◐◐
50%U6_2◐◐◐
50%U6_3+3V3◐◐◐
50%R8_1NRST◐◐◐
50%U6_5Net-(U6-C1)◐◐◐
50%C50_1GND◐◐◐
50%U6_7MAG_INT◐◐◐
50%C50_2+5V◐◐◐
50%U6_9+3V3◐◐◐
50%C33_1+3V3◐◐◐
50%C33_2GND◐◐◐
50%R22_1Net-(U9-XC1)◐◐◐
50%R22_2Net-(U9-XC2)◐◐◐
50%C2_1Net-(U2-SW)◐◐◐
50%C2_2Net-(U2-BST)◐◐◐
50%C40_1GND◐◐◐
50%C40_2+3V3◐◐◐
50%L4_1Net-(U9-ANT1)◐◐◐
50%L4_2Net-(U9-ANT2)◐◐◐
50%C18_1Net-(C18-Pad1)◐◐◐
50%C16_1Net-(C16-Pad1)◐◐◐
50%DZ1_1+BATT◐◐◐
33%Q1_4Net-(DZ1-A)○◐◐
17%J1_1GND◐○○
17%J13_6GND◐○○
17%J14_2GND◐○○
17%J11_4GND◐○○
17%J12_1+3V3◐○○
17%J4_1GND◐○○
17%J2_6GND◐○○
17%D3_3+5V◐○○
17%D1_1GND◐○○
17%Y1_2GND◐○○
17%U3_2GND◐○○
17%J9_2VCC◐○○
17%Y2_3GND◐○○
17%Q2_5+BATT◐○○
17%J9_1GND◐○○
17%J10_1+3V3◐○○
17%J12_4GND◐○○
17%J11_1+3V3◐○○
17%D4_3+5V◐○○
17%C48_1+5V◐○○
17%C48_2GND◐○○
17%Y2_2GND◐○○
17%J2_1+5V◐○○
17%J5_1+5V◐○○
17%J5_6GND◐○○
17%D2_3+5V◐○○
17%J8_1GND◐○○
17%J8_2+BATT◐○○
17%J7_1GND◐○○
17%D3_1GND◐○○
17%J3_1+5V◐○○
17%J13_10GND◐○○
17%J10_4GND◐○○
17%J3_4GND◐○○
17%D2_1GND◐○○
17%C11_1GND◐○○
17%C11_2+BATT◐○○
17%D4_1GND◐○○
17%J13_4+3V3◐○○
17%Y1_3GND◐○○
0%J14_1Antenna○○○
0%J1_3THRR○○○
0%Q2_1Net-(D1-A)○○○
0%Q2_2Net-(D1-A)○○○
0%Q2_3Net-(D1-A)○○○
0%Q2_4Net-(Q2-G)○○○
0%D3_2Net-(D2-DOUT)○○○
0%D4_4Net-(D4-DOUT)○○○
0%D1_2Net-(D1-A)○○○
0%L1_1Net-(U1-SW)○○○
0%D2_4Net-(D2-DOUT)○○○
0%Y1_1Net-(U7-PH0)○○○
0%J7_2Net-(D1-A)○○○
0%J4_3THRL○○○
0%U3_3Net-(DZ1-A)○○○
0%L2_1Net-(U2-SW)○○○
0%Y2_1Net-(U9-XC2)○○○
0%J4_2○○○
0%D4_2Net-(D3-DOUT)○○○
0%Y2_4Net-(U9-XC1)○○○
0%J5_2TX1○○○
0%J5_3RX1○○○
0%J5_4○○○
0%J5_5○○○
0%Y1_4Net-(C28-Pad2)○○○
0%D2_2Net-(D2-DIN)○○○
0%J13_9SD_Detect○○○
0%D3_4Net-(D3-DOUT)○○○
0%J1_2○○○

14.8.6 Scoring Matrix

PCOLA/SOQ scoring premises used for this analysis. Each cell shows the score assigned when a test method applies to a component or pin.

MethodPCOLASOpensQ
AOIFullFullFull—PartialPartialPartialPartial
AXI————PartialPartialPartialPartial
JTAG/BSCANFullFullFullPartial—FullFull—
BSCAN_PassivesFullFullFullFull—FullFull—
I2CPartialPartial—Partial—PartialPartial—
SPIPartialPartial—Partial—PartialPartial—
UART———Partial————
Passive_MeasFullFullFullFull—FullFull—
Powered_OffPartial————PartialFull—

15 Component Properties

Schematic library symbol quality analysis.

15.1 Library Symbol Grades

Grading schematic library symbol quality based on pin electrical type definitions:

Grade Definitions
GradeRatingDescription
AExcellentHas Power pins AND properly typed I/O pins (>=90% typed)
BGood>=70% typed OR (>=50% typed AND has Power)
CFairMix of typed and Passive pins (>=40% typed)
DPoorMostly Passive with few typed pins (>=10% typed)
FFailAll pins Passive/Unknown (<10% typed, no ERC)
IC Library Symbol Grades (sorted worst to best)
RefDesGrdPinsPwrInOutIOOCOEHiZPasPart NumberCreator
U1C622100001AP63205WU
U2C622100001AP63203WU
U4B622100001LM74700
U9B2094200005nRF24L01P
U6B1244040000LIS2MDLTR
U7B1001130820004STM32F765VITx
U10A522100000SN74LV1T34DBV
U3A320010000US1881
U5A1041050000LPS22HBTR
U8A1442260000LSM6DSO

15.1.1 Library Quality Summary

Total ICs evaluated10
Grade A (excellent)4 (40.0%)
Grade B (good)4 (40.0%)
Grade C (fair)2 (20.0%)
Grade D (poor)0 (0.0%)
Grade F (fail)0 (0.0%)
OVERALL LIBRARY QUALITYA (3.56/4.00)

15.2 Component Library Validation

The shared part-number check could not be performed: no part-number property is populated on the passive components. The AI-enriched run resolves part identities and enables this check.

Checking for generic/incomplete library symbols using statistical patterns.

Library Symbol Issues (4 symbols)
Library NameIndustry NamePart NumberRefDesPinsDistributionIssues
AP63203WUAP63203WU-U26P:1 Pwr:2 I:2 O:1 Power-named pins not typed as Power - library pin types incomplete [SW=Output, BST=Passive]
AP63205WUAP63205WU-U16P:1 Pwr:2 I:2 O:1 Power-named pins not typed as Power - library pin types incomplete [SW=Output, BST=Passive]
LIS2MDLTRLIS2MDLTR-U612Pwr:4 Bi:4 ?:4 33% of pins are Unknown type
STM32F765VITxSTM32F765VITx-U7100P:4 Pwr:11 Bi:82 I:3 Pin 10 (VSS) at same location as pin 26 (VSS); Pin 10 (VSS) at same location as pin 49 (VSS); Pin 10 (VSS) at same location as pin 74 (VSS); Pin 10 (VSS) at same location as pin 99 (VSS); Pin 26 (VSS) at same location as pin 49 (VSS); Pin 26 (VSS) at same location as pin 74 (VSS); Pin 26 (VSS) at same location as pin 99 (VSS); Pin 49 (VSS) at same location as pin 74 (VSS); Pin 49 (VSS) at same location as pin 99 (VSS); Pin 74 (VSS) at same location as pin 99 (VSS); Power-named pins not typed as Power - library pin types incomplete [VREF+=Input, VSS=Passive, VSS=Passive, VSS=Passive, VSS=Passive]

15.2.1 Validation Heuristics

All pins same type: Generic library with no electrical rules

High % passive pins on IC: Incomplete type information

No power pins: May indicate separate power symbol

Low type diversity: Very underspecified library symbol

Power-named pins not typed as Power: Library pin types incomplete

15.3 Symbol vs Datasheet Pin Table

Each symbol's pin numbers are compared with the pin table of its datasheet. A datasheet pin the symbol lacks is a warning only when the datasheet calls it electrical; a pin the datasheet marks NC or mechanical, or a symbol pin the table does not list, is shown for information. An exposed pad is never counted as a mismatch, whether the symbol names it or numbers it one past the last pin. Where it was numbered, the row suggests giving it a name, because a bare number does not tell a reader what the pin is.

15 parts compared with their datasheet: 15 agree, 0 differ.
Every symbol compared matches its datasheet's pin table.

15.4 Shielded Connector Symbol Quality

Shielded connectors with missing pin names0
All shielded connectors have proper pin names for EMC analysis.

15.5 I/O Bank Power

U7 STM32F765VITx: 3 I/O banks checked against the vendor package file; 94 of 94 symbol pin names agree with it
U7 bank VDD (): supply balls of one bank on different nets - Net-(C16-Pad1): 100; Net-(C15-Pad1): 11; Net-(C13-Pad1): 27; Net-(C12-Pad1): 50; Net-(C18-Pad1): 75

15.6 Footprints and Other Models

Components with model data28
Component Model Assignments
RefDesIndustry NamePinsModel TypeModel
D2SK68124FootprintLED_SMD:LED_SK6812_PLCC4_5.0x5.0mm_P3.2mm
D3SK68124FootprintLED_SMD:LED_SK6812_PLCC4_5.0x5.0mm_P3.2mm
D4SK68124FootprintLED_SMD:LED_SK6812_PLCC4_5.0x5.0mm_P3.2mm
J1-3FootprintConnector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical
J2-6FootprintConnector_JST:JST_GH_BM06B-GHS-TBT_1x06-1MP_P1.25mm_Vertical
J3-4FootprintConnector_JST:JST_GH_BM04B-GHS-TBT_1x04-1MP_P1.25mm_Vertical
J4-3FootprintConnector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical
J5-6FootprintConnector_JST:JST_GH_BM06B-GHS-TBT_1x06-1MP_P1.25mm_Vertical
J6-6FootprintConnector_PinHeader_2.54mm:PinHeader_1x06_P2.54mm_Vertical
J10-4FootprintConnector_JST:JST_GH_BM04B-GHS-TBT_1x04-1MP_P1.25mm_Vertical
J11-4FootprintConnector_JST:JST_GH_BM04B-GHS-TBT_1x04-1MP_P1.25mm_Vertical
J12-4FootprintConnector_JST:JST_GH_BM04B-GHS-TBT_1x04-1MP_P1.25mm_Vertical
J13-10FootprintConnector_Card:microSD_HC_Hirose_DM3AT-SF-PEJM5
J15-3FootprintConnector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical
Q1-5FootprintPackage_SO:PowerPAK_SO-8L_Single
Q2AON6262E5FootprintPackage_TO_SOT_SMD:TDSON-8-1
U1AP63205WU6FootprintPackage_TO_SOT_SMD:TSOT-23-6
U2AP63203WU6FootprintPackage_TO_SOT_SMD:TSOT-23-6
U3US18813FootprintPackage_TO_SOT_THT:TO-92
U4LM747006FootprintPackage_TO_SOT_SMD:SOT-23-6
U5LPS22HBTR10FootprintPackage_LGA:ST_HLGA-10_2x2mm_P0.5mm_LayoutBorder3x2y
U6LIS2MDLTR12FootprintPackage_LGA:LGA-12_2x2mm_P0.5mm
U7STM32F765VITx100FootprintPackage_QFP:LQFP-100_14x14mm_P0.5mm
U8LSM6DSO14FootprintPackage_LGA:LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4y
U9nRF24L01P20FootprintPackage_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
U10SN74LV1T34DBV5FootprintPackage_TO_SOT_SMD:SOT-23-5
Y1-4FootprintCrystal:Crystal_SMD_3225-4Pin_3.2x2.5mm
Y2-4FootprintCrystal:Crystal_SMD_3225-4Pin_3.2x2.5mm

15.7 IC Pin Electrical Properties

Unique IC symbols10
Total IC instances10
IC Library Symbols
Industry NameLibrary NameRefDesNotes
AP63203WUAP63203WUU2
AP63205WUAP63205WUU1
LIS2MDLTRLIS2MDLTRU6
LM74700LM74700U4
LPS22HBTRLPS22HBTRU5
LSM6DSOLSM6DSOU8
SN74LV1T34DBVSN74LV1T34DBVU10
STM32F765VITxSTM32F765VITxU7
US1881US1881U3
nRF24L01PnRF24L01PU9

15.7.1 AP63203WU (AP63203WU)

PinPin NameElectricalNotes
1FBInput
2ENInput
3INPower In
4GNDPower In
5SWOutput
6BSTPassive

15.7.2 AP63205WU (AP63205WU)

PinPin NameElectricalNotes
1FBInput
2ENInput
3INPower In
4GNDPower In
5SWOutput
6BSTPassive

15.7.3 LIS2MDLTR (LIS2MDLTR)

PinPin NameElectricalNotes
1SCL/SPCBidirectional
2NCUnknown
3CSBidirectional
4SDA/SDI/SDOBidirectional
5C1Unknown
6GNDPower In
7INT/DRDY/SDOBidirectional
8GNDPower In
9VDDPower In
10VDD_IOPower In
11NCUnknown
12NCUnknown

15.7.4 LM74700 (LM74700)

PinPin NameElectricalNotes
1VCAPPassive
2GNDPower In
3ENInput
4CATHODEInput
5GATEOutput
6ANODEPower In

15.7.5 LPS22HBTR (LPS22HBTR)

PinPin NameElectricalNotes
1VDD_IOPower In
2SCL/SPCBidirectional
3RESUnknown
4SDA/SDI/SDOBidirectional
5SDO/SA0Bidirectional
6CSBidirectional
7INT_DRDYBidirectional
8GNDPower In
9GNDPower In
10VDDPower In

15.7.6 LSM6DSO (LSM6DSO)

PinPin NameElectricalNotes
1SDO/SA0Bidirectional
2SDxBidirectional
3SCxBidirectional
4INT1Output
5VDDIOPower In
6GNDPower Out
7GNDPower Out
8VDDPower In
9INT2Output
10OCS_AuxBidirectional
11SDO_AuxBidirectional
12CSInput
13SCLInput
14SDABidirectional

15.7.7 SN74LV1T34DBV (SN74LV1T34DBV)

PinPin NameElectricalNotes
1NCUnknown
2AInput
3GNDPower In
4YOutput
5VCCPower In

15.7.8 STM32F765VITx (STM32F765VITx)

PinPin NameElectricalNotes
1PE2Bidirectional
2PE3Bidirectional
3PE4Bidirectional
4PE5Bidirectional
5PE6Bidirectional
6VBATPower In
7PC13Bidirectional
8PC14Bidirectional
9PC15Bidirectional
10VSSPower In
11VDDPower In
12PH0Bidirectional
13PH1Bidirectional
14NRSTInput
15PC0Bidirectional
16PC1Bidirectional
17PC2Bidirectional
18PC3Bidirectional
19VSSAPower In
20VREF+Input
21VDDAPower In
22PA0Bidirectional
23PA1Bidirectional
24PA2Bidirectional
25PA3Bidirectional
26VSSPassive
27VDDPower In
28PA4Bidirectional
29PA5Bidirectional
30PA6Bidirectional
31PA7Bidirectional
32PC4Bidirectional
33PC5Bidirectional
34PB0Bidirectional
35PB1Bidirectional
36PB2Bidirectional
37PE7Bidirectional
38PE8Bidirectional
39PE9Bidirectional
40PE10Bidirectional
41PE11Bidirectional
42PE12Bidirectional
43PE13Bidirectional
44PE14Bidirectional
45PE15Bidirectional
46PB10Bidirectional
47PB11Bidirectional
48VCAP_1Power Out
49VSSPassive
50VDDPower In
51PB12Bidirectional
52PB13Bidirectional
53PB14Bidirectional
54PB15Bidirectional
55PD8Bidirectional
56PD9Bidirectional
57PD10Bidirectional
58PD11Bidirectional
59PD12Bidirectional
60PD13Bidirectional
61PD14Bidirectional
62PD15Bidirectional
63PC6Bidirectional
64PC7Bidirectional
65PC8Bidirectional
66PC9Bidirectional
67PA8Bidirectional
68PA9Bidirectional
69PA10Bidirectional
70PA11Bidirectional
71PA12Bidirectional
72PA13Bidirectional
73VCAP_2Power Out
74VSSPassive
75VDDPower In
76PA14Bidirectional
77PA15Bidirectional
78PC10Bidirectional
79PC11Bidirectional
80PC12Bidirectional
81PD0Bidirectional
82PD1Bidirectional
83PD2Bidirectional
84PD3Bidirectional
85PD4Bidirectional
86PD5Bidirectional
87PD6Bidirectional
88PD7Bidirectional
89PB3Bidirectional
90PB4Bidirectional
91PB5Bidirectional
92PB6Bidirectional
93PB7Bidirectional
94BOOT0Input
95PB8Bidirectional
96PB9Bidirectional
97PE0Bidirectional
98PE1Bidirectional
99VSSPassive
100VDDPower In

15.7.9 US1881 (US1881)

PinPin NameElectricalNotes
1VDDPower In
2GNDPower In
3OUTPUTBidirectional

15.7.10 nRF24L01P (nRF24L01P)

PinPin NameElectricalNotes
1CEInput
2CSNInput
3SCKInput
4MOSIInput
5MISOOutput
6IRQOutput
7VDDPower In
8VSSPower In
9XC2Passive
10XC1Passive
11VDD_PAPower Out
12ANT1Passive
13ANT2Passive
14VSSPower In
15VDDPower In
16IREFPassive
17VSSPower In
18VDDPower In
19DVDDPower Out
20VSSPower In